Polyphenylene ether resin composition and prepreg containing same, laminated board and printed-circuit board

Abstract

The invention provides a thermosetting polyphenylene ether resin composition and a prepreg containing the same, and a laminated board. The polyphenylene ether resin composition comprises: (1) vinyl benzyl ether modified thermosetting polyphenylene ether resin with five functional groups or more; and (2) a vinyl resin crosslinking agent, wherein with the weight of the vinyl benzyl ether modified thermosetting polyphenylene ether resin with five functional groups or more as 100 parts by weight, the weight of the vinyl resin crosslinking agent is 40 to 100 parts by weight. Because the vinyl benzyl ether modified thermosetting polyphenylene ether resin contains a styrene active group containing five functional groups or more, more vinyl resin crosslinking agent can be crosslinked; a prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, so the high-speed electronic circuit substrate has better thermal oxidative aging resistant properties, and the stability of the dielectric constant and dielectric loss of the substrate in a long-term use process is good.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a polyphenylene ether resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity of information, and the high frequency and high speed of transmission signals have been applied to high-end communication network hardware equipment such as routers, switches, and servers. The transmission lines of electronic circuit boards used by etc. are getting longer and longer, requiring electronic circuit substrates to have lower dielectric constant and lower dielectric loss. [0003] For high-speed electronic circuit substrates, maintaining the stability of the dielectric constant and dielectric loss of the substrate during long-term use will hav...

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Problems solved by technology

[0009] The above-mentioned prior art has the following problems: in order to obtain lower dielectric constant and lower dielectric loss, it is necessary to increase the use ratio of vinyl resin crosslinking agent such as polybutadiene

Although the prepared base material has lower low dielectric constant and lower dielectric loss, the styrene active groups carried by the bifunctional or tetrafunctional vinyl benzyl ether modified thermosetting polyphenylene ether resin are limited, Can not completely react the excess vinyl resin crosslinking agent such as polybutadiene side chain double bond

Incompletely reacted vinyl resin crosslinking agents such as polybutadiene side chain double bonds have poor thermal and oxidative aging resistance, which seriously affects the stability of the dielectric constant and dielectric loss of the substrate during long-term use, thereby making the substrate The signal integrity performance deteriorates and cannot meet customer needs

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