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Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL)

A polytetrafluoroethylene, high-frequency microwave technology, applied in the direction of film/sheet adhesives, adhesives, etc., can solve the problem of affecting the service life and performance of the adhesive layer, and the curing time of the adhesive is difficult to grasp and reduce Adhesive adhesion and other issues, to achieve the effect of easy curing time, improve service life and performance, and improve adhesion

Inactive Publication Date: 2017-05-10
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process of copper clad laminates, solvents need to be used, but the solvent components in the prior art are relatively single, which will affect the service life and performance of the adhesive layer during the manufacturing process of copper clad laminates, making the adhesive The curing time is not easy to control, and at the same time reduces the adhesive force of the adhesive

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0012] A solvent material formula for a polytetrafluoroethylene high-frequency microwave copper clad laminate. The copper clad laminate includes an adhesive layer, a substrate layer, and a copper foil layer. The adhesive layer is coated on the substrate layer, The adhesive layer includes a solvent, a flame retardant, and a radiation shielding agent. The solvent is composed of the following components by weight: 8 parts by weight of dimethyl glutarate, 6 parts by fatty alcohol polyoxyethylene ether, and alkyl alcohol 4 parts of amide, 5 parts of polyvinylpyrrolidone, 5 parts of rosin resin, 6 parts of methyl tributyl ketoxime silane, 10 parts of triethylenetetramine, 15 parts of dimethyl adipate, 7 parts of dimethylformamide and 10 parts of polyacrylamide.

Embodiment 2

[0014] A solvent material formula for a polytetrafluoroethylene high-frequency microwave copper clad laminate. The copper clad laminate includes an adhesive layer, a substrate layer, and a copper foil layer. The adhesive layer is coated on the substrate layer, The adhesive layer includes a solvent, a flame retardant, and a radiation protection agent. The solvent is composed of the following components by weight: 15 parts by weight of dimethyl glutarate, 20 parts by fatty alcohol polyoxyethylene ether, and alkyl alcohol 15 parts of amide, 16 parts of polyvinylpyrrolidone, 19 parts of rosin resin, 18 parts of methyl ketoxime silane, 25 parts of triethylenetetramine, 25 parts of dimethyl adipate, 20 parts of dimethylformamide and 15 parts of polyacrylamide.

Embodiment 3

[0016] A solvent material formula for a polytetrafluoroethylene high-frequency microwave copper clad laminate. The copper clad laminate includes an adhesive layer, a substrate layer, and a copper foil layer. The adhesive layer is coated on the substrate layer, The adhesive layer includes a solvent, a flame retardant, and an anti-radiation agent. The solvent is composed of the following components by weight: 12 parts by weight of dimethyl glutarate, 15 parts by fatty alcohol polyoxyethylene ether, and alkyl alcohol 9 parts of amide, 12 parts of polyvinylpyrrolidone, 14 parts of rosin resin, 15 parts of methyl tributyl ketoxime silane, 20 parts of triethylenetetramine, 20 parts of dimethyl adipate, 13 parts of dimethylformamide and 12 parts of polyacrylamide.

[0017] In the present invention, the solvent in the adhesive layer is changed from dimethyl glutarate, fatty alcohol polyoxyethylene ether, alkyl alcohol amide, polyvinyl pyrrolidone, rosin resin, methyl tributyl ketoxime si...

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Abstract

The invention discloses a solvent material formula for a polytetrafluoroethylene high-frequency microwave CCL, a solvent in an adhesive layer is mixed with dimethyl glutarate, fatty alcohol-polyoxyethylene ether, alkanolamide, polyvinylpyrrolidone, rosin resin, methyl-tri-butanone-oxime silane, triethylene tetramine, dimethyl adipate, dimethyl formamide and polyacrylamide at normal temperature and pressure by stirring, the obtained solvent is applied to the production technology of the CCL, the dielectric property and the mechanical property of the CCL can be improved, at the same time, the service life of the adhesive layer is prolonged and the use performance of the adhesive layer is improved, the curing time of the adhesive is easy to master, and the adhesive force of the adhesive is improved simultaneously.

Description

Technical field [0001] The invention relates to the technical field of copper clad laminate production, in particular to a solvent material formula for polytetrafluoroethylene high frequency microwave copper clad laminate. Background technique [0002] Copper clad laminate is also called base material. It is a plate-shaped material made of wood pulp paper or fiberglass cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and then hot pressed. Copper clad laminate. It is the basic material for PCB, often called substrate, and when it is used for multilayer board production, it is also called core board. According to mechanical rigidity, copper clad laminates are divided into rigid boards and flexible boards; according to the structure of different insulating materials, they are divided into: organic resin-based copper clad laminates, metal-based copper clad laminates, and ceramic-based copper clad laminates; according to thicknes...

Claims

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Application Information

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IPC IPC(8): C09J11/00C09J7/02
CPCC09J11/00C09J7/20
Inventor 孙茂云
Owner 金宝电子(铜陵)有限公司
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