Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates

A copper clad laminate and solvent technology, used in non-polymer adhesive additives, adhesives, electronic equipment, etc. To solve problems such as adhesive adhesion, it can achieve the effect of easy curing time, improving service life and performance, and improving adhesion.

Inactive Publication Date: 2017-05-17
金宝电子(铜陵)有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process of copper clad laminates, solvents need to be used, but the solvent components in the prior art are relatively single, which will affect the service life and performance of the adhesive layer during the manufacturing process of copper clad laminates, making the adhesive The curing time is not easy to control, and at the same time reduces the adhesive force of the adhesive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A solvent material formula for CAF-resistant copper-clad laminates with a high CTI value. The copper-clad laminates include an adhesive layer, a base material layer, and a copper foil layer. The adhesive layer is coated on the base material layer. The adhesive layer includes a solvent, a flame retardant, and a radiation protection agent, and the solvent is composed of the following components by weight: 3 parts of polydimethylsiloxane, 5 parts of alkylphenol polyoxyethylene ether, stearin 6 parts of monoglyceride, 10 parts of polyvinyl alcohol, 4 parts of Arabic resin, 3 parts of dimethylimidazole, 10 parts of diethylenetriamine, 4 parts of dimethyl glutarate, 9 parts of diethylene glycol dibutyl ether And polyacrylamide 10 parts.

Embodiment 2

[0014] A solvent material formula for CAF-resistant copper-clad laminates with a high CTI value. The copper-clad laminates include an adhesive layer, a base material layer, and a copper foil layer. The adhesive layer is coated on the base material layer. The adhesive layer includes a solvent, a flame retardant, and a radiation protection agent, and the solvent is composed of the following components by weight: 10 parts of polydimethylsiloxane, 12 parts of alkylphenol polyoxyethylene ether, stearin 9 parts of monoglyceride, 25 parts of polyvinyl alcohol, 9 parts of Arabic resin, 8 parts of dimethylimidazole, 15 parts of diethylenetriamine, 8 parts of dimethyl glutarate, 20 parts of diethylene glycol dibutyl ether And 24 parts of polyacrylamide.

Embodiment 3

[0016] A solvent material formula for CAF-resistant copper-clad laminates with a high CTI value. The copper-clad laminates include an adhesive layer, a base material layer, and a copper foil layer. The adhesive layer is coated on the base material layer. The adhesive layer includes a solvent, a flame retardant, and a radiation protection agent, and the solvent is composed of the following components in parts by weight: 7 parts of polydimethylsiloxane, 9 parts of alkylphenol polyoxyethylene ether, stearin 8 parts of monoglyceride, 15 parts of polyvinyl alcohol, 7 parts of Arabic resin, 5 parts of dimethylimidazole, 13 parts of diethylenetriamine, 6 parts of dimethyl glutarate, 15 parts of diethylene glycol dibutyl ether And polyacrylamide 18 parts.

[0017] In the present invention, the solvent in the adhesive layer is made of polydimethylsiloxane, alkylphenol polyoxyethylene ether, stearic acid monoglyceride, polyvinyl alcohol, Arabic resin, dimethylimidazole, diethylenetri A...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
boiling pointaaaaaaaaaa
flash pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses a solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates. According to the solvent material formula, a solvent in an adhesive layer is prepared by stirring and mixing polydimethylsiloxane, alkyl phenol polyoxyethylene ether, glycerol monoester stearate, polyvinyl alcohol, arabia gum, dimethyl imidazole, diethylenetriamine, dimethyl glutarate, di-ethylene glycol di-butyl ether and polyacrylamide under normal temperature and normal pressure. When the prepared solvent is used in a production process of copper-clad plates, dielectric properties and mechanical properties of the copper-clad plates can be improved; the service life of the adhesive layer is prolonged; the service performance of the adhesive layer is improved; the curing time of the adhesive is easy to master; the adhesion of the adhesive is improved.

Description

technical field [0001] The invention relates to the technical field of production of copper-clad laminates, in particular to a solvent material formula for high-CTI-value CAF-resistant copper-clad laminates. Background technique [0002] Copper clad laminate, also known as base material, is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot-pressed as a plate-shaped material, called Copper Clad Laminates. It is the basic material for PCB, often called the base material, and when it is used in the production of multilayer boards, it is also called the core board. According to mechanical rigidity, copper clad laminates are divided into rigid plates and flexible plates; according to different insulating material structures, they are divided into: organic resin copper clad laminates, metal based copper clad laminates, and ceramic based copper clad laminates; according to thicknes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J129/04C09J133/26C09J171/02C09J183/04C09J11/06B32B7/12
CPCB32B7/12B32B2255/02B32B2255/12B32B2255/26B32B2307/20B32B2307/50B32B2457/08C08L2203/20C08L2205/035C09J11/06C09J129/04C09J133/26C08L33/26C08L83/04C08L71/02C08K5/00C08K5/103C08K5/3445C08K5/11C08L29/04
Inventor 孙茂云胡金山
Owner 金宝电子(铜陵)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com