Organic silicon electronic potting adhesive for PCB circuit board with stable dielectric insulation performance

Abstract

The invention discloses an organic silicon electronic potting adhesive for a PCB circuit board with stable dielectric insulation performance. The organic silicon electronic potting adhesive is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated silicone oil-1, 50 to 60 parts of vinyl-terminated silicone oil-2, 0.38 to 0.5 part of 12% of a platinum catalyst, 0.02 to 0.04 part of acetenyl cyclohexanol, 25 to 30 parts of vinyl silicon resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-epoxypropane, 23 to 25 parts of 1,3,5,7-tetramethyl cyclotetrasiloxane, 2.7 to 3.6 parts of a silane coupling agent A171, an appropriate amount of silicon-containing silicon oil, 2.6 to 3 parts of mica powder, 1.8 to 3 parts of porcelain powder, 0.2 to 0.3 part of dimethyl silicone polymer, 4.6 to 5 parts of carboxylated latex, 1.1 to 1.6 parts of polyvinyl alcohol and an appropriate amount of deionized water. The potting adhesive disclosed by the invention has high heat conduction, dielectric insulation, impact resistance and adhesive performance, is high in fluidity, and is extremely suitable for potting electronic products.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone electronic potting glue for PCB circuit boards with stable dielectric insulation performance. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The device is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual meth...

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market for PCB circuit boards, and its performance is not high in all aspects, so it must be further improved to expand the scope of use.