Packaging technology and packaging structure of ceramic chip
A technology of chip packaging structure and packaging technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of contaminating the connection area of ceramic chips, reducing labor and transportation costs, etc., and achieve product yield improvement, The effect of reducing labor and transportation costs and convenient operation
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[0032] This embodiment is a packaging process for ceramic chips, such as figure 1 shown, including the following steps:
[0033] (1) Dispensing and film formation: Before chip assembly, apply liquid dual-cure sealant to the outer edge of the side of the ceramic carrier that needs to be packaged with the cover plate through a dispenser, and cure the dual-cure sealant by UV light irradiation Shaped to form a structural adhesive film on the ceramic carrier; the dispenser includes a horizontal moving platform 4 whose displacement and direction are controlled by the first controller 8, a dispensing head 3 whose glue output is controlled by the second controller 2, and a horizontal moving platform 4 The displacement and direction are controlled by the first controller 8; the glue output of the dispensing head 3 is controlled by the second controller 2; the glue is applied to the outer edge 7 of the ceramic carrier through the dispensing head 3 to form a horizontal glue line 6, and t...
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