LTCC (Low Temperature Co-fired Ceramic) substrate with novel laminated structure

Abstract

The invention provides a LTCC (Low Temperature Co-fired Ceramic) substrate with a novel laminated structure, which is formed by laminating and sintering multiple layers of green ceramic sheets. A metal printing layer is printed between adjacent green ceramic sheets; the edges of the metal printing layers are all retracted inwardly; edges of the bottom three metal printing layers are retracted inwardly for 0.3 mm; the fourth metal printing layer is a lower radio frequency ground layer; one part of the edge of the lower radio frequency ground layer is convex, the front edge of the convex part is inwardly retracted for 0.05 mm, and other edges of the lower radio frequency ground layer are inwardly retracted for 0.3 mm. According to the LTCC substrate provided by the invention, convex-shaped processing is carried out through simulation calculation on design of the radio frequency ground, two layers of green ceramic sheets with different appearances and sizes are laminated, in the case of large-area paving design, metal printing layer opening processing is carried out at an edge connection place, and the opening needs to avoid interconnected metalized holes between layers of the LTCC. The LTCC module manufactured by the substrate structure has the advantages of small size and light weight, and on the basis of not increasing the weight and the size, the air tightness of the LTCC module is improved.

Description

technical field [0001] The invention relates to the field of LTCC substrates, in particular to an LTCC substrate with a novel laminated structure. Background technique [0002] With the continuous development of communication technology and modern high-tech level, the requirements for the size, weight and performance of electronic systems are getting higher and higher, especially for space-borne, missile-borne, airborne and individual weapon systems. Electronic components and components are developing rapidly in the direction of short, small, light, thin, high reliability, high performance and low cost. At present, in the microwave and millimeter wave frequency band, a single MMIC chip cannot yet achieve complex system-level integration, and the original microwave hybrid integrated circuit can no longer meet the needs of high-density system integration. The multi-chip component technology developed in the 1990s is to solve this problem A new method, this technology assemble...

AI Technical Summary

Problems solved by technology

However, the traditional miniaturized and lightweight LTCC modules mostly use the structure of the bottom plate, LTCC substrate, frame, and cover plate, such as figure 1 As shown, the LTCC substrate in this structure is exposed, and the airtightness of the module is poor

There are two main factors affecting the airtightness. One is the welding level of mechanical parts such as the module cover, frame and bottom plate; the other is the incomplete airtightness caused by the different materials between the LTCC substrate layers.

In the prior art, the method of all-metal packaging is often used to improve the airtightness, and the LTCC substrate is arranged and packaged inside the metal shell. Although this method improves the airtightness, it inevitably increases the weight and size, and introduces New RF transition components increase losses and reflections

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