Composite material integrating flame retardance and heat conductivity and preparation method thereof

A composite material and thermal conductivity technology, applied in the field of epoxy resin-based composite materials, can solve the problems of poor mechanical properties, thermal properties and processing fluidity, and achieve excellent flame retardant and thermal conductivity, good mechanics, and excellent flame retardant effect. Effect

Inactive Publication Date: 2017-05-17
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In response to the above defects or improvement needs of the prior art, the purpose of the present invention is to provide a composite material with both flame retardancy and thermal conductivity and its preparation method, wherein the structure of the key additives in the polymer-based thermal conductive composite material , composition, addition amount, and addition process are improve

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  • Composite material integrating flame retardance and heat conductivity and preparation method thereof
  • Composite material integrating flame retardance and heat conductivity and preparation method thereof
  • Composite material integrating flame retardance and heat conductivity and preparation method thereof

Examples

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Example Embodiment

[0038] The specific steps of the preparation method of the above-mentioned high flame-retardant thermally conductive composite material are as follows:

[0039] (a) Add flame-retardant graphene to the epoxy resin prepolymer, stir and mix to obtain a uniform epoxy resin prepolymer / graphene dispersion system;

[0040] (b) Add micron-sized thermally conductive filler to the epoxy resin prepolymer / graphene dispersion system obtained in step (a), stir at high speed (the speed used for stirring can be 800-1500 rpm), mix evenly, and obtain flame retardant Thermally conductive epoxy dispersion system;

[0041] (c) The flame-retardant and thermally conductive epoxy resin dispersion system obtained in step (b) is evacuated and degassed, then a curing agent is added, and then the temperature is increased for curing to obtain a highly flame-retardant and thermally conductive composite material.

[0042] In the above technical solution, the flame-retardant graphene in step (a) is one of reduced gr...

Example Embodiment

[0052] Example 1

[0053] Contains 1wt% reduced graphene oxide (RGO), 10wt% Al 2 O 3 Preparation of epoxy-based thermally conductive composite materials, including bisphenol F epoxy resin prepolymer (model: YDF-170, epoxy equivalent 160-180), 2-ethyl-4-methylimidazole curing agent, hydrazine hydrate Reduce graphene oxide and α-Al 2 O 3 , The epoxy resin prepolymer accounts for 94wt% of the epoxy resin part, the curing agent accounts for 6wt% of the epoxy resin part, and the reduced graphene accounts for 1wt% of the epoxy resin part. α-Al 2 O 3 The content accounts for 10wt% of the total composite material mass

[0054] Use the solution mixing method to first mix the graphene oxide (RGO) reduced by hydrazine hydrate into the epoxy resin prepolymer: According to the ratio in Table 1, 180 mg of RGO (relative to the epoxy resin) is ultrasonically dispersed (1h, 100W) Into 100mL of acetone solution, then the acetone solution (50mL) in which 16.75g of epoxy resin prepolymer is dissolved ...

Example Embodiment

[0057] Example 2

[0058] Contains 1wt% reduced graphene oxide (RGO), 20wt% Al 2 O 3 Preparation of epoxy-based thermally conductive composite materials, including bisphenol F epoxy resin prepolymer (model: YDF-170, epoxy equivalent 160-180), 2-ethyl-4-methylimidazole curing agent, hydrazine hydrate Reduce graphene oxide and α-Al 2 O 3 , The epoxy resin prepolymer accounts for 94wt% of the epoxy resin part, the curing agent accounts for 6wt% of the epoxy resin part, and the reduced graphene accounts for 1wt% of the epoxy resin part. α-Al 2 O 3 The content accounts for 20wt% of the total composite material mass

[0059] According to the method of Example 1, according to the raw material ratio of the composite material in Table 1, after solution mixing, mechanical mixing and temperature programmed curing, the epoxy resin / Al is finally obtained 2 O 3 / RGO composite material sample, for ease of writing, the composite material is abbreviated as EP / Al 2 O 3 / RGO-20.

[0060] EP / Al measured...

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Abstract

The invention discloses a composite material integrating flame retardance and heat conductivity and a preparation method thereof. The composite material is prepared from flame-retardant graphene, heat conductive filler and an epoxy resin base material and is an epoxy resin-based composite material of which the heat conductivity and the flame retardance are synergistically enhanced by the flame-retardant graphene and the heat conductive filler, wherein the flame-retardant graphene occupies 0.5 to 5 weight percent of the composite material; the heat conductive filler occupies 10 to 70 weight percent of the composite material; the flame-retardant graphene is at least one of reduced graphene oxide and organic flame retardant modified reduced graphene oxide. According to the composite material disclosed by the invention, by modifying the structure, the components, the dosage, the adding technology and the like of critical additives in a polymer-based heat conductive composite material, compared with the prior art, the problems that the mechanical performance, the heat performance and the processing fluidity of the polymer-based heat conductive composite material in which the additives are added are poor can be effectively solved.

Description

Technical field [0001] The invention belongs to the technical field of manufacturing polymer-based thermally conductive composite materials, and more specifically, relates to a composite material having both flame retardancy and thermal conductivity and a preparation method thereof. The composite material specifically has both high flame retardancy and high thermal conductivity. Characteristic epoxy-based composite material. Background technique [0002] The miniaturization and integration of electronic components lead to efficient and rapid heat dissipation, which has become one of the most urgent problems to be solved in the contemporary electronics industry. Polymer-based thermally conductive composites (PTC) have become a very widely used electronic packaging material due to their light weight, low price, and easy processing. However, due to the flammable nature of the polymer material itself and the heat generated by the integrated circuit itself, PTC materials used for ele...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/04C08K3/22C08K3/38C08K9/04
CPCC08K3/04C08K3/22C08K3/38C08K9/04C08K2003/2227C08K2003/385C08L2201/02C08L63/00
Inventor 解孝林冯跃战周兴平叶昀昇陈超
Owner HUAZHONG UNIV OF SCI & TECH
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