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A splitter combiner and Ku-band high-power solid-state power amplifier

A technology of power amplifiers and dividers and combiners, which is applied in the field of communication to achieve the effects of reducing assembly relations, enhancing stability, and improving equipment quality

Active Publication Date: 2019-03-01
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Application Information

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Problems solved by technology

The power capacity of this amplifier can reach 100W, and the normal operation of the power amplifier will not be affected when a final power amplifier module with a high failure rate fails, which solves the high reliability and all-solid-state high power required in the Ku-band scattering communication system Power Amplifier Requirements

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  • A splitter combiner and Ku-band high-power solid-state power amplifier
  • A splitter combiner and Ku-band high-power solid-state power amplifier
  • A splitter combiner and Ku-band high-power solid-state power amplifier

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Embodiment Construction

[0021] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0022] figure 1 It is a schematic diagram of the structure of a Ku-band high-power solid-state power amplifier of the present invention, including a driver-level power amplifier 1, an isolation and coupling component 4, a power detector 5, and splitters 2 and 2 n final stage power amplifiers 3; the number of final stage power amplifiers 3 is 2 n number, n is a positive integer, 8 are selected in this embodiment; the power amplifier 1 of the driving stage is loaded on the input waveguide port of the splitter 2; the eight final stage power amplifiers 3 are respectively fixed on the upper surface of the splitter 2, The input waveguide interfaces of the eight final-stage power amplifiers 3 are in one-to-one correspondence with the eight branch output ports on the upper surface of the splitter-combiner 2, and the output waveguide interfaces...

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Abstract

The invention discloses a divider-combiner and a Ku-band high-power solid-state power amplifier. The Ku-band high-power solid-state power amplifier includes a driving stage power amplifier, a divider-combiner, a final-stage power amplifier, isolation and coupling components; the divider-combiner The mutual isolation with the power amplifier module is realized through the waveguide magic T; the final power amplifier receives the RF drive signal output by the splitter combiner through the bottom waveguide interface, and after amplification, it is output to the divider combiner through the bottom waveguide interface; the isolation coupling component passes through the waveguide interface The fastening screws are loaded onto the split-combiner. The present invention realizes the isolation of the final stage power amplifier by adopting the splitter / combiner isolated from each port and the modular power amplifier module, improves the maintainability of the equipment, and enhances the stability of the system; the present invention adopts 8 power amplifiers through parallel The power combination realizes the continuous wave 100W power output.

Description

technical field [0001] The invention relates to a splitter and combiner in the field of communication and a Ku-band high-power solid-state power amplifier, which is particularly suitable for a transmission device that completes radio frequency signal power amplification in a transmission channel of a Ku-band scattering communication system. Background technique [0002] With the development of scattering communication technology, the requirements for the transmit power of the Ku-band communication system are increasing. At present, the solid-state power amplifiers of the order of 100 watts widely used in the Ku frequency band of the scattering communication system usually use a dozen or so MMIC power amplifier tubes of several watts or a dozen watts for power synthesis. It can not meet the requirements of high reliability and rapid maintenance of scattering communication. SUMMARY OF THE INVENTION [0003] The technical problem to be solved by the present invention is to p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03F3/195H03F3/21H03F3/24H01P5/20
CPCH01P5/20H03F3/195H03F3/21H03F3/245
Inventor 杨作成李楠朱秀敏张志忠杨贺张静王路强仝信男
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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