Unlock instant, AI-driven research and patent intelligence for your innovation.

A preparation method of a thick-film chip linear negative temperature coefficient thermistor

A technology of negative temperature coefficient and thermistor, which is applied in the manufacture of resistors, resistors and resistors with negative temperature coefficient, can solve the problem of low precision, resistance accuracy and reliability, and small thickness of single-layer NTC film. , complex process and other problems, to achieve the effect of improved efficiency, stable product performance and low material cost

Active Publication Date: 2019-01-22
CHINA ZHENHUA GRP YUNKE ELECTRONICS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The multi-layer thick film type needs to be based on the LTCC (low temperature multi-layer co-fired ceramics) platform, formed by tape casting, and then printed with multi-layer cross electrodes. formula NTCR, the structure is designed as figure 1 As shown, this type of chip NTCR needs to be sintered at a high temperature (about 1150°C) with a multi-layer inner electrode silver-palladium paste, which has high cost and complicated process. The electrode layers have interpenetration phenomenon, and the accuracy of B value (material constant), resistance value accuracy and reliability are not high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A preparation method of a thick-film chip linear negative temperature coefficient thermistor
  • A preparation method of a thick-film chip linear negative temperature coefficient thermistor
  • A preparation method of a thick-film chip linear negative temperature coefficient thermistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Ingredients and mixing

[0035] Weigh fluororubber (0.9) and conductive carbon black (0.1) in proportion, dissolve fluororubber with butyl acetate solvent, add silane coupling agent, add conductive carbon black under stirring state, according to product TCR value and resistance value Adjust the formula until the carbon black is uniformly dispersed in the fluororubber solution to form a slurry-like polymer composite.

[0036] (2) Printed electrodes

[0037] Print the back electrode and surface electrode on the ceramic substrate, and sinter to obtain the ceramic substrate with printed electrodes. The sintering temperature is 850°C / 10 minutes;

[0038] (3) Printing polymer composite paste

[0039] The polymer composite paste is printed on the ceramic substrate printed with electrodes, the thickness of the printed film is 0.10mm (reference value), the specific thickness is printed according to the required resistance, and then the thermistor ceramic substrate is obtai...

Embodiment 2

[0051] The ingredient formula is changed to: 0.75 parts of fluororubber and 0.25 parts of conductive carbon black, 0.2% of coupling agent, and butyl acetate solvent are added according to the viscosity. Other process conditions remain unchanged, and finally choose 8 chip thermistor products, and their electrical performance test results are shown in Table 2.

[0052] Table 2 The electrical properties of the chip thermistor samples prepared after the formula was changed

[0053] sample

Room temperature resistance / kΩ

Room temperature resistivity / Ω·cm

85℃ resistance / kΩ

TCR / (ppm / ℃)

1#

30.66

245.28

19.54

6044.792

2#

30.23

241.84

19.35

5998.456

3#

30.53

244.24

19.36

6097.827

4#

31.18

249.44

20.13

5906.564

5#

30.87

246.96

19.87

5938.883

6#

31.04

248.32

20.03

5911.727

7#

29.98

239.84

19.01

6098.510

8#

29.93

239.44

18.99

...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
electrical resistanceaaaaaaaaaa
electrical resistanceaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing a thick film type linear negative temperature coefficient (NTC) thermal resistor. The method comprises the following steps: preparing an NTC temperature-sensitive polymer composite material similar to slurry, taking the composite material as slurry for preparing a thick film type linear thermal resistor, and regulating the formula of the polymer composite material according to the needs of a TCR (Temperature Coefficient of Resistant) value and a resistance value of the product; printing an electrode in advance on a ceramic substrate in the preparation process, firing, and printing the polymer composite material slurry; printing a protective layer on the polymer composite material film layer, and finally, performing splitting, end seal and surface treatment, thereby obtaining the thick film type linear NTC thermal resistor. The thick film type linear NTC thermal resistor prepared by the method disclosed by the invention has the characteristics of being adjustable in resistance value, high in stability of the resistance value and the TCR value and stable in product performance, the resistance temperature characteristic has a linear change rule, and the like. According to the technical scheme provided by the invention, the method has an important practical value in industrial production of the thick film type linear NTC thermal resistors.

Description

technical field [0001] The invention belongs to the field of stable negative temperature coefficient (NTC) heat-sensitive polymer composite materials and components, and in particular relates to a linear and reliable chip-type NTCR preparation process. Background technique [0002] Most heat-sensitive components are made of heat-sensitive materials with positive temperature coefficient or negative temperature coefficient. The working principle is to use the resistivity of ceramics to change with temperature. Typical heat-sensitive materials include heat-sensitive polymer materials and heat-sensitive ceramic materials. Thermal materials include nonlinear NTC (Negative Temperature Coefficient), nonlinear PTC (Positive Temperature Coefficient), linear NTC and linear PTC. At present, thermosensitive ceramics are mainly used as materials for preparing nonlinear NTCR and PTCR. Only a few thermosensitive ceramic materials containing Cd elements are used as raw materials for prepari...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C17/065
CPCH01C7/041H01C7/049H01C17/065H01C17/06586
Inventor 杨康庞锦标何创创居奎徐泽鹏班秀峰韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS