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Laser interference micro-nano processing device and method based on reflective Damman grating beam splitting

A Damman grating and micro-nano processing technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of large loss, strong 0-order light, and low diffraction efficiency, and achieve stable and reliable fixation with obvious advantages , the effect of simple operation

Active Publication Date: 2018-10-23
YANBIAN UNIV +1
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Damman grating is a spatial coordinate modulation type binary phase grating, which can divide the incident light into output arrays with equal intensity and the same interval according to the requirements, which avoids the maximum light intensity of the traditional grating at level 0 and the intensity of each level. Disadvantages of uneven light distribution, low diffraction efficiency, and large loss

Method used

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  • Laser interference micro-nano processing device and method based on reflective Damman grating beam splitting
  • Laser interference micro-nano processing device and method based on reflective Damman grating beam splitting
  • Laser interference micro-nano processing device and method based on reflective Damman grating beam splitting

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example 1

[0027] as attached figure 1 As shown, the device of the present invention includes a laser 1, a collimated beam expander system 2, a beam shaper 3, a reflective Damman grating 4, mirrors 5, 6, 7, 8, slideways 9, 10, and a phase modulator 11 , 12, 13 materials to be processed.

[0028] The laser light emitted by the laser 1 passes through the collimating beam expander system 2, and the beam shaper 3 homogenizes the Gaussian distributed energy of the laser to make it into a flat-top beam with uniform energy distribution, and shapes its spot shape as Square to facilitate splicing in the processing area. The shaped light beam reaches the reflective Damman grating 4, and the reflective Damman grating 4 divides the light beam into two beams of reflected light of +1 level and -1 level with equal light intensity. Reflected on the mirrors 7, 8, adjust the position and deflection angle of the mirrors 7, 8 on the slides 9, 10, so that the two beams of reflected light form interference ...

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Abstract

The invention relates to a laser interference micro-nano machining device and method based on reflective dammann grating beam splitting. Based on the diffractive beam splitting characteristic of the reflective dammann grating beam splitting, a single beam of laser subjected to collimation and beam expanding and beam shaping is split into multiple beams of coherent light with the same oscillator intensity, and after being reflected by reflecting mirrors, the multiple beams of coherent light are gathered to the surface of a to-be-processed material for interference to obtain interference laser stripes to be processed to form a periodic parallel groove micro-nano structure. The distance between grooves can be regulated by changing the angles and the positions of the reflecting mirrors, so as to form a periodically controllable micro-nano structure. Compared with a conventional beam splitting device, the laser interference micro-nano machining device has the advantages that operation is simple, fixation is stable and reliable, advantages are more remarkable in interference in multiple beams, and the reflecting mirrors are symmetric and convenient for change and regulation of the processing cycle after laser splitting.

Description

technical field [0001] The invention belongs to the field of laser interference micro-nano processing, and in particular relates to a device and method for laser interference processing based on a reflective Damman grating. Background technique [0002] Laser interference micro-nano processing technology uses two or more laser beams to interfere on the surface of the material to form a periodic energy distribution of alternating strength and weakness, and then realize the three-dimensional etching of the material by the laser. By controlling the process parameters such as the azimuth, polarization direction, incident angle, intensity and exposure time of the laser beam, the micro-nano structure of a specific size is obtained on the surface of the material by using the multi-beam laser interference processing technology. Compared with traditional laser direct writing micro-nano processing, this technology has the advantages of large processing area, high efficiency, low cost,...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/067B23K26/073
CPCB23K26/0673B23K26/0732B23K26/355
Inventor 李永亮李林蔚王斯琦李仕明王渊博白冲雷雨
Owner YANBIAN UNIV