Halogen-free thermosetting resin composition, prepreg comprising same, laminated board and printed circuit board

A resin composition and thermosetting technology, applied in the fields of halogen-free thermosetting resin composition and prepreg containing it, laminates and printed circuit boards, can solve the problems of general dielectric constant and dielectric loss of resin composition, etc., Achieve the effect of increasing the glass transition temperature, reducing the probability of moisture absorption and explosion, and reducing the value of dielectric loss

Inactive Publication Date: 2017-05-31
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The epoxy resin containing the oxazolidinone ring structure disclosed by it has high heat resistance, high adhesion, excelle

Method used

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  • Halogen-free thermosetting resin composition, prepreg comprising same, laminated board and printed circuit board
  • Halogen-free thermosetting resin composition, prepreg comprising same, laminated board and printed circuit board
  • Halogen-free thermosetting resin composition, prepreg comprising same, laminated board and printed circuit board

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Embodiment Construction

[0071] In order to facilitate understanding of the present invention, the present invention enumerates the following examples. It should be clear to those skilled in the art that the embodiments are only for helping to understand the present invention, and should not be regarded as specific limitations on the present invention.

[0072] Test the glass transition temperature, dielectric constant, dielectric loss factor, peel strength, heat resistance, water absorption, flame retardancy and other properties of the printed circuit laminate (4 pieces of prepreg), as follows The examples are further detailed and described.

[0073] The preparation method of the copper-clad laminate adopted in the present invention is:

[0074] Mix halogen-free epoxy resin, polyphosphonate, cyanate, phosphorus-containing flame retardant, curing accelerator, and filler in a solvent in a certain proportion, control the solid content of the glue to 65%, and use 2116 glass fiber cloth Immerse the abov...

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Abstract

The invention provides a halogen-free thermosetting resin composition, a prepreg comprising the same, a laminated board and a printed circuit board. The halogen-free thermosetting resin composition comprises the following substances serving as necessary components, in 100 parts of organic solid matters by weight: (A) 35-65 parts of halogen-free epoxy resin; (B) 10-35 parts of poly-phosphonate; (C) 10-30 parts of cyanate ester. The halogen-free thermosetting resin composition, the prepreg comprising the same, the laminated board and the printed circuit board have high glass transition temperature, excellent dielectric property, high peeling strength, high heat resistance, low water absorption and good process machinability, can realize halogen-free flame resistance and reach UL94 V-0.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a halogen-free thermosetting resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. The substrate material will no longer play the role of mechanical support in the traditional sense, but will become a PCB and terminal together with electronic components. An important way for manufacturers and designers to improve product performance. Because a high Dk will slow down the signal transmission rate, and a high Df will cause the signal part to be converted into heat energy and be lost in the substrate material, so reducing Dk / Df has become a hot pursuit of the substrate industry. In this context, cyanate ester resins with excellent ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/04C08G59/26C08G59/40C08J5/24B32B5/02B32B5/26B32B15/14B32B37/06B32B37/10
CPCC08G59/26C08G59/4071C08L63/00B32B5/02B32B5/26B32B15/14B32B37/06B32B37/10C08J2479/04C08J2363/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2205/035B32B2260/046B32B2260/021B32B2307/3065B32B2457/08C08J5/244C08J5/249C08L79/04
Inventor 游江黄天辉林伟杨中强
Owner GUANGDONG SHENGYI SCI TECH
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