A kind of graphene oxide modified led heat conduction potting glue and preparation method thereof

A technology of graphene modification and heat conduction potting, which is applied in adhesives, semiconductor devices, non-polymer adhesive additives, etc., to achieve excellent thermal conductivity and improve the preparation process

Active Publication Date: 2020-01-14
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem of heat dissipation of power LEDs and the deficiencies of the existing silicone potting glue technology, the present invention provides a graphene oxide modified silicone LED heat-conducting potting glue with good filling processability and good thermal conductivity and its preparation method to meet the higher requirements of integrated LEDs on the thermal conductivity of encapsulants

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Weigh 200 parts by weight of aluminum nitride and add it into a high-speed kneader, slowly add 1 part by weight of γ-methylacrylophthaloxypropyltrimethoxysilane diluted with ethanol solution in advance under the condition of high-speed stirring, and the dropwise addition is completed After that, heat up to 70°C and continue stirring at high speed for 2 hours, discharge the material, place the obtained filler in a vacuum drying oven to remove residual water and ethanol, and sieve to obtain γ-methylacrylicphthalein with an average particle size of 2.5 m Aluminum nitride surface treated with oxypropyltrimethoxysilane.

[0031] Weigh 200 parts by weight of aluminum oxide and add it into a high-speed kneader, slowly add 1 part by weight of γ-methacrylphthaleinoxypropyltrimethoxysilane diluted with ethanol solution in advance under the condition of high-speed stirring, dropwise After completion, raise the temperature to 70°C and continue stirring at high speed for 2 hours, di...

Embodiment 2

[0036] The preparation method and conditions of the graphene oxide modified LED heat-conducting encapsulant of the present invention are as in Example 1, the addition of graphene oxide is increased to 5 parts by weight, and the corresponding hydrogen content is 0.3% hydrogen-containing silicone oil The cross-linking agent remains unchanged, and the graphene oxide modified LED heat-conducting potting glue is prepared, and the performance test results are shown in Table 1. It can be seen that increasing the content of graphene oxide in an appropriate range is conducive to improving the thermal conductivity of the potting compound, and has little effect on the fluidity of the heat-conducting potting compound.

Embodiment 3

[0038]The preparation method and conditions of the graphene oxide modified LED heat-conducting encapsulant of the present invention are as in Example 1, and the vinyl polydimethylsiloxane is changed to a polydimethylsiloxane with a viscosity of 400 mPa·s and a vinyl content of 0.60wt%. Straight-chain vinyl polydimethylsiloxane, correspondingly, the hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.3% is increased to 6.9 parts by weight, and the weight part of graphene oxide is 4 parts, and the modified graphene oxide is obtained. The performance test results are shown in Table 1. It can be seen that compared with Example 2, the thermal conductivity of the encapsulant is improved.

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Abstract

The invention relates to graphene oxide modified organic silicon heat conducting pouring sealant for an LED electronic product and a preparation method of the graphene oxide modified LED heat conducting pouring sealant. The preparation method comprises the following steps: uniformly dispersing graphene oxide and vinyl-base polydimethylsiloxane in a vacuum kneading machine, adding a surface modified heat conducting filler, dehydrating and blending for 50 to 100 minutes at the temperature of 70 to 100 DEG C and a vacuum degree of 0.07 to 0.09 MPa, thus obtaining a base material; adding a hydrogen-containing silicone oil and a cross-linking inhibitor into the base material at a normal temperature, sufficiently stirring for 20 to 40 minutes to obtain a component A; adding a platinum catalyst into the base material at a normal temperature, and sufficiently stirring for 20 to 40 minutes to obtain a component B; uniformly blending the component A and the component B of a same amount, defoaming for 6 to 12 minutes at the vacuum degree of 0.05 to 0.07 MPa, thus obtaining the graphene oxide modified LED heat conducting pouring sealant. The pouring sealant has appropriate viscosity, the heat conducting coefficient is 1.1 to 1.4 w / m.k, a cured product has good mechanical performance and electric performance, can be cured at a normal temperature or can be heated to be cured, and can be widely used for encapsulating integrated electronic elements and devices, high-power chips, integrated circuit boards, circuit modules and the like with high heat dissipation requirement.

Description

technical field [0001] The invention relates to the technical field of electronic potting materials, in particular to a graphene oxide modified LED heat-conducting potting glue and a preparation method thereof. Background technique [0002] LED lighting has the advantages of environmental protection, energy saving, and long service life, and it is of great significance to solve problems such as environmental pollution and resource depletion. Silicone heat-conducting potting compound has good comprehensive performance, and has been widely used in the heat dissipation packaging protection of electronic components such as LEDs. However, with the continuous improvement of LED brightness requirements, LED power will become larger and larger, and the LED industry is developing in the direction of integration. When multiple LED chips are densely arranged, the resulting thermal effect will be more serious, and the problem of heat dissipation It has become an important technical pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/08C09J11/04C09J11/06H01L33/56
CPCC08K2201/003C08L2203/206C08L2205/025C09J11/04C09J11/06C09J11/08C09J183/04H01L33/56C08L83/04C08K13/06C08K9/06C08K2003/282C08K3/04C08K2003/2227
Inventor 贺建芸张景慧罗锡丹何振文赵长松李嘉维康维嘉杨卫民丁玉梅
Owner BEIJING UNIV OF CHEM TECH
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