Chip-grade LED (Light Emitting Diode) packaging device with controllable light emitting angle and packaging process
A technology of LED packaging and lighting angle, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing device luminous efficiency, uneven light color in space, and hidden dangers in reliability, so as to reduce the risk of chip cracking and reduce diffusion Area, the effect of improving mechanical properties
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Embodiment 1
[0035] This embodiment provides a chip-level LED packaging device with controllable luminous angle, such as figure 1As shown, it includes a sapphire LED chip 2 with an electrode 1 on the bottom surface, the electrode 1 is composed of a positive electrode and a negative electrode, there is a gap between the positive electrode and the negative electrode, and a diffusion layer 3 is provided on the top and side of the LED chip 2 , the diffusion layer 3 is located above the electrode 1, the top of the diffusion layer 3 is provided with a fluorescent adhesive layer 4, and the sides of the LED chip 2, the diffusion layer 3, and the fluorescent adhesive layer 4 are provided with a first white wall glue layer 5 , the refractive index of the LED chip 2 is greater than the refractive index of the diffusion layer 3 , and the refractive index of the diffusion layer 3 is greater than the refractive index of the fluorescent glue layer 4 . In this embodiment, the LED chip 2 is a sapphire chip...
Embodiment 2
[0048] This embodiment provides a chip-level LED packaging device with controllable luminous angle, such as figure 2 As shown, it includes a sapphire LED chip 2 with an electrode 1 on the bottom surface, the electrode 1 is composed of a positive electrode and a negative electrode, there is a gap between the positive electrode and the negative electrode, and a diffusion layer 3 is provided on the top and side of the LED chip 2 , the diffusion layer 3 is located above the electrode 1, the top of the diffusion layer 3 is provided with a fluorescent adhesive layer 4, and the sides of the LED chip 2, the diffusion layer 3, and the fluorescent adhesive layer 4 are provided with a first white wall glue layer 5 , the refractive index of the LED chip 2 is greater than the refractive index of the diffusion layer 3 , and the refractive index of the diffusion layer 3 is greater than the refractive index of the fluorescent glue layer 4 . In this embodiment, the LED chip 2 is a sapphire ch...
Embodiment 3
[0061] This embodiment provides a chip-level LED packaging device with controllable luminous angle, such as image 3 As shown, it includes a sapphire LED chip 2 with an electrode 1 on the bottom surface, the electrode 1 is composed of a positive electrode and a negative electrode, there is a gap between the positive electrode and the negative electrode, and a diffusion layer 3 is provided on the top and side of the LED chip 2 , the diffusion layer 3 is located above the electrode 1, the top of the diffusion layer 3 is provided with a fluorescent adhesive layer 4, and the sides of the LED chip 2, the diffusion layer 3, and the fluorescent adhesive layer 4 are provided with a first white wall glue layer 5 , the refractive index of the LED chip 2 is greater than the refractive index of the diffusion layer 3 , and the refractive index of the diffusion layer 3 is greater than the refractive index of the fluorescent glue layer 4 . In this embodiment, the LED chip 2 is a sapphire chi...
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