Method of preparing Ge-based plasma pin diode used for reconfigurable multilayer holographic antenna
A holographic antenna and plasma technology, applied in the directions of antennas, antenna parts, antenna supports/installation devices, etc., can solve the problems of large injection dose and energy, uneven doping concentration, incompatibility, etc., and improve the breakdown voltage. , controllability enhancement, the effect of suppressing influence
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Embodiment 1
[0058] See figure 1 , figure 1 A structural schematic diagram of a reconfigurable multilayer holographic antenna provided by an embodiment of the present invention, an embodiment of the present invention provides a method for preparing a Ge-based plasmonic pin diode for a reconfigurable multilayer holographic antenna, wherein the The Ge-based plasmonic pin diode is used to make a reconfigurable multilayer holographic antenna, and the reconfigurable multilayer holographic antenna (1) includes: a GeOI semiconductor substrate (11), an antenna module (13), a first holographic ring (15) and the second holographic ring (17); wherein, the antenna module (13), the first holographic ring (15) and the second holographic ring (17) all include serially connected Ge-based plasmonic pin diode strings.
[0059] Specifically, the antenna module (13), the first holographic ring (15) and the second holographic ring (17) are all manufactured on the GeOI semiconductor substrate (11) by using a ...
Embodiment 2
[0105] See Figure 3a-Figure 3s , Figure 3a-Figure 3s It is a schematic diagram of a method for preparing a Ge-based plasma pin diode according to an embodiment of the present invention. On the basis of the first embodiment above, to prepare a Ge-based solid-state plasma pin diode with a channel length of 22nm (the length of the solid-state plasma region is 100 microns) As an example to describe in detail, the specific steps are as follows:
[0106] Step 1, substrate material preparation steps:
[0107] (1a) if Figure 3a As shown, the (100) crystal orientation is selected, the doping type is p-type, the doping concentration is a GeOI substrate 101 of 1014 cm-3, and the thickness of the top layer Ge is 50 μm;
[0108] (1b) if Figure 3b As shown, a first SiO2 layer 201 with a thickness of 40nm is deposited on a GeOI substrate by chemical vapor deposition (Chemical vapor deposition, CVD for short); A first Si3N4 / SiN layer 202 with a thickness of 2 μm;
[0109] Step 2, is...
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