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Method of preparing Ge-based plasma pin diode used for reconfigurable multilayer holographic antenna

A holographic antenna and plasma technology, applied in the directions of antennas, antenna parts, antenna supports/installation devices, etc., can solve the problems of large injection dose and energy, uneven doping concentration, incompatibility, etc., and improve the breakdown voltage. , controllability enhancement, the effect of suppressing influence

Inactive Publication Date: 2017-06-09
XIAN CREATION KEJI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the materials used in pin diodes used in plasma reconfigurable antennas at home and abroad are all bulk silicon materials. This material has the problem of low carrier mobility in the intrinsic region, which affects the carrier concentration in the intrinsic region of the pin diode. Affect its solid-state plasma concentration; and the P region and N region of this structure are mostly formed by implantation process, which requires a large implant dose and energy, high requirements on equipment, and is incompatible with existing processes; and the diffusion process, Although the junction depth is deep, but at the same time, the area of ​​the P region and the N region is large, the integration degree is low, and the doping concentration is uneven, which affects the electrical performance of the pin diode, resulting in poor controllability of the solid-state plasma concentration and distribution.

Method used

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  • Method of preparing Ge-based plasma pin diode used for reconfigurable multilayer holographic antenna
  • Method of preparing Ge-based plasma pin diode used for reconfigurable multilayer holographic antenna
  • Method of preparing Ge-based plasma pin diode used for reconfigurable multilayer holographic antenna

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Embodiment 1

[0058] See figure 1 , figure 1 A structural schematic diagram of a reconfigurable multilayer holographic antenna provided by an embodiment of the present invention, an embodiment of the present invention provides a method for preparing a Ge-based plasmonic pin diode for a reconfigurable multilayer holographic antenna, wherein the The Ge-based plasmonic pin diode is used to make a reconfigurable multilayer holographic antenna, and the reconfigurable multilayer holographic antenna (1) includes: a GeOI semiconductor substrate (11), an antenna module (13), a first holographic ring (15) and the second holographic ring (17); wherein, the antenna module (13), the first holographic ring (15) and the second holographic ring (17) all include serially connected Ge-based plasmonic pin diode strings.

[0059] Specifically, the antenna module (13), the first holographic ring (15) and the second holographic ring (17) are all manufactured on the GeOI semiconductor substrate (11) by using a ...

Embodiment 2

[0105] See Figure 3a-Figure 3s , Figure 3a-Figure 3s It is a schematic diagram of a method for preparing a Ge-based plasma pin diode according to an embodiment of the present invention. On the basis of the first embodiment above, to prepare a Ge-based solid-state plasma pin diode with a channel length of 22nm (the length of the solid-state plasma region is 100 microns) As an example to describe in detail, the specific steps are as follows:

[0106] Step 1, substrate material preparation steps:

[0107] (1a) if Figure 3a As shown, the (100) crystal orientation is selected, the doping type is p-type, the doping concentration is a GeOI substrate 101 of 1014 cm-3, and the thickness of the top layer Ge is 50 μm;

[0108] (1b) if Figure 3b As shown, a first SiO2 layer 201 with a thickness of 40nm is deposited on a GeOI substrate by chemical vapor deposition (Chemical vapor deposition, CVD for short); A first Si3N4 / SiN layer 202 with a thickness of 2 μm;

[0109] Step 2, is...

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Abstract

The invention discloses a method of preparing a Ge-based plasma pin diode used for a reconfigurable multilayer holographic antenna. The Ge-based plasma pin diode is used for the production of the reconfigurable multilayer holographic antenna, and the method of preparing the Ge-based plasma pin diode comprises steps that a GeOI substrate in one crystal direction is selected, and an isolation area is disposed in the GeOI substrate; the GeOI substrate is etched to form a P type groove and an N type groove, and the depth of the P type groove and the depth of the N type groove are smaller than the thickness of the top layer Ge of the GeOI substrate; a first P type active area and a first N type active area are formed in the P type groove and the N type groove by adopting an ion implantation way; by filling the P type groove and the N type groove, a second P type active area and a second N type active area are formed in the top layer Ge of the GeOI substrate by adopting the ion implantation way; a lead is formed on the GeOI substrate to complete the preparation of the Ge-based plasma pin diode. The high performance Ge-based plasma pin diode suitable for forming the reconfigurable multilayer holographic antenna is prepared by adopting the deep groove isolation technology and the ion implantation technology.

Description

technical field [0001] The invention belongs to the technical field of semiconductor device manufacturing, relates to the technical field of antennas, in particular to a method for preparing a Ge-based plasma pin diode used for a reconfigurable multilayer holographic antenna. Background technique [0002] Due to its relatively large weight and volume, the traditional metal antenna is inflexible in design and manufacture, and its self-reconfiguration and adaptability are poor, which seriously restricts the development and performance improvement of radar and communication systems. Therefore, in recent years, the theory of antenna broadband, miniaturization, and reconfiguration and multiplexing has become increasingly active. [0003] Against this background, the researchers proposed a new antenna concept-plasma antenna, which is a radio-frequency antenna that uses plasma as a guiding medium for electromagnetic radiation. The plasma antenna can change the instantaneous bandwi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q1/36H01L21/329H01L29/868
CPCH01Q1/2283H01L29/6609H01L29/868H01Q1/36
Inventor 尹晓雪张亮
Owner XIAN CREATION KEJI CO LTD
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