Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin type flexible copper clad laminate and production method thereof

A flexible, copper clad laminate technology, applied in the field of flexible circuit boards, can solve the problems of thick thickness, complex production process, poor magnetic conductivity or shielding uniformity of copper clad laminates, and achieve thin thickness, good heat resistance and uniformity. high effect

Inactive Publication Date: 2017-06-13
成都三益新材料有限公司
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention overcomes the deficiencies of the prior art, and provides a flexible copper clad laminate with thinner thickness, more uniform lamination, high magnetic conduction or shielding uniformity and a preparation method thereof, which solves the problems of existing clad laminates. Poor uniformity of copper plate magnetic conduction or shielding, thicker thickness, complex production process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin type flexible copper clad laminate and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] like figure 1As shown, the present invention includes an upper copper foil 1, an EMI film 2 for magnetic conduction and electromagnetic interference prevention, and a lower copper foil 3 arranged sequentially from top to bottom, and the upper copper foil 1, EMI film 2, and lower copper foil 3 are all It is a roll type, and the adhesive 4 is coated between the EMI film 2 and the upper copper foil 1 and between the EMI film 2 and the lower copper foil 3. The adhesive 4 is a kind of epoxy glue, acrylic hot melt adhesive, or thermoplastic PI resin. . Both the copper foil and the EMI film 2 of the present invention are rolled, and when the product is processed, the material is transferred out from the roll, and the adhesive 4 is coated on the surface of the material or the material layers are laminated. When this method is produced, the strength and uniformity of the pressing are higher, so that the thickness of each layer can be reduced correspondingly and the performance ...

Embodiment 2

[0039] On the basis of Example 1, the thickness capability of the upper copper foil 1 and the lower copper foil 3 is the thinnest 6 μm; the thickness capability of the adhesive 4 is the thinnest 3 μm; the thickness capability of the EMI film 2 is the thinnest Thin 5 μm. The minimum thickness of the copper foil can reach 6 μm, and the minimum thickness of the EMI film 2 can reach 5 μm, and the thickness of each material is reduced, so that the overall thickness of the product is correspondingly reduced, which conforms to the development trend of thinning electronic products.

Embodiment 3

[0041] On the basis of Embodiment 1 or 2, the EMI film 2 is a kind of conductive adhesive film, high resistance body, and metal foil, so that the EMI film 2 can have good magnetic permeability and shielding effect. The adhesive 4 is a thermoplastic PI resin, so that the product has better heat resistance and higher flatness.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of flexible circuit boards, in particular to a thin type flexible copper clad laminate and a production method thereof. According to the technical scheme, the thin type flexible copper clad laminate comprises upper copper foil, an EMI thin film and lower copper foil which are sequentially arranged from top to bottom, wherein the EMI thin film is used for magnetic conduction and preventing electromagnetic interference, each of the upper copper foil, the EMI thin film and the lower copper foil is of a roll type, a position between the EMI thin film and the upper copper foil is coated with an adhesive, a position between the EMI thin film and the lower copper foil is coated with the adhesive, and the adhesive is one of an epoxy adhesive, an acrylic acid hot melt adhesive and thermoplastic PI resin. The production method is characterized in that roll type production is adopted, two sides of the EMI thin film are sequentially coated with the adhesive, each copper foil is pressed to the corresponding side of the EMI thin film and curing is performed or coating and pressing are sequentially performed from top to bottom during production. The thin type flexible copper clad laminate and the production method thereof have the advantages that the thin type flexible copper clad laminate produced by the roll type production is thin, even in pressing and high in magnetic conduction or shielding evenness, and the problem that an existing copper clad laminate is poor in magnetic conduction or shielding evenness and thick is solved.

Description

technical field [0001] The invention relates to the field of flexible circuit boards, in particular to a thin flexible copper-clad board and a preparation method thereof. Background technique [0002] Compared with the traditional rigid printed circuit board (PCB), the flexible printed circuit board (FPC) has many advantages: 1) It has a very thin insulation thickness; 2) It can greatly reduce the package size and package weight. In the trend of light, thin, short and small, the miniaturization requirements of many portable electronic products are almost impossible to wire without flexible printed boards, such as cameras, video cameras, mobile phones, notebook computers, LCD TVs, etc.; 3) It is very easy to realize three-dimensional wiring, which effectively reduces the space occupied by wiring; 4) Greatly reduces the assembly cost; 5) It is easy to realize high density, refinement and functionalization of electronic circuits; High reliability and mobility, especially in oc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/04B32B15/20B32B15/01B32B7/12B32B33/00B32B37/12B32B37/10B32B38/00H05K1/02
CPCB32B15/04B32B7/12B32B15/01B32B15/20B32B33/00B32B37/10B32B37/1284B32B38/0036B32B2038/0076B32B2250/40B32B2307/202B32B2307/208B32B2307/212B32B2307/306B32B2309/02B32B2309/12B32B2457/08H05K1/0216H05K2201/0723
Inventor 胡学平郑全智
Owner 成都三益新材料有限公司