Conductive ink composition with self-repair functions, method for preparing conductive ink composition and application thereof

A conductive ink, self-healing technology, used in applications, inks, household appliances, etc., can solve problems such as property loss, shortening service life, waste of resources, etc., and achieve the effect of increasing solid content

Inactive Publication Date: 2017-06-13
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, flexible circuits are inevitably vulnerable to external mechanical damage during the production and use process, shortening their service life, leading to electronic device failure, resource waste and property loss.

Method used

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  • Conductive ink composition with self-repair functions, method for preparing conductive ink composition and application thereof
  • Conductive ink composition with self-repair functions, method for preparing conductive ink composition and application thereof
  • Conductive ink composition with self-repair functions, method for preparing conductive ink composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A preparation method of a conductive ink composition with self-repair function, the steps comprising:

[0029] 1) Heat 1g of polytetrahydrofuran (PTMEG2000) to 80°C, keep the vacuum below 0.1 MPa, dehydrate for 1h, cool down to 50°C, add 0.222g of isophorone diisocyanate and 10g of N,N-dimethylformamide , stirred at 100 °C for 6 h, then cooled to 50 °C;

[0030] 2) Add 0.115g of 4,4-diaminodiphenyl disulfide and 0.009g of hyperbranched polyamidoamine to the system in step 1), and react at 100 °C for 5 h to obtain self-sustainable polyamide containing disulfide bonds and hyperbranched structure. repaired polymers;

[0031] 3) The polymer in step 2) was uniformly mixed with 2.6 g of a 50% silver trifluoroacetate solution in N,N-dimethylformamide to obtain a conductive ink composition with a self-healing function.

[0032] Example 1 Self-healing polymer TGA curve such as figure 1 Shown; Conductive ink composition stress-strain curve such as figure 2 shown.

[0033] A...

Embodiment 2

[0035] 1) Heat 1g polytetrahydrofuran (PTMEG2000) to 80°C, keep the vacuum below 0.1 MPa, dehydrate for 1h, cool down to 50°C, add 0.111g isophorone diisocyanate, 0.125g diphenylmethylene diisocyanate and 10g Dimethylformamide, stirred and reacted at 100°C for 6 h, cooled to 50°C;

[0036] 2) Add 0.120g of 4,4-diaminodiphenyl disulfide and 0.005g of hyperbranched polyamidoamine to the system in step 1), and continue to react at 100 °C for 5 h to obtain a polyamide containing disulfide bond and hyperbranched structure. self-healing polymers;

[0037] 3) The polymer in step 2) was uniformly mixed with 1.4 g of a 50% silver trifluoroacetate solution in N,N-dimethylformamide to obtain a conductive ink composition with self-healing function.

[0038] Application: The conductive ink composition of Example 2 was written on paper with a brush, and reduced by 50 mL / L formaldehyde solution at room temperature for 20 minutes to obtain a conductive line with a conductivity of 140 S cm -...

Embodiment 3

[0040] 1) Mix 1g polyethylene glycol (M w 2000) heated to 80°C, kept the vacuum below 0.1 MPa, dehydrated for 1h, cooled to 50°C, added 0.250g of diphenylmethylene diisocyanate and 15g of N,N-dimethylformamide, stirred and reacted at 120°C 4 h, cool down to 50 ℃;

[0041] 2) Add 0.058g dithiodiethanol and 0.005g hyperbranched polyamidoamine to the system in step 1), and react at 120 °C for 4 hours to obtain a self-healing polymer containing disulfide bonds and hyperbranched structures;

[0042] 3) The polymer in step 2) was uniformly mixed with 1.4 g of a 30% silver trifluoroacetate solution in N,N-dimethylformamide to obtain a conductive ink composition with a self-healing function.

[0043] Application: The conductive ink composition of Example 3 was written on glass by a brush, and reduced by 50 mL / L formaldehyde solution at room temperature for 20 minutes to obtain a conductive circuit with a conductivity of 80 S cm -1 .

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PUM

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Abstract

The invention discloses a conductive ink composition with self-repair functions, a method for preparing the conductive ink composition and application thereof. The method includes steps of stirring and heating polyester or polyether glycol until the temperature of the polyester or polyether glycol reaches 80-100 DEG C, dehydrating the polyester or polyether glycol under the condition of the vacuum degree lower than 0.1 MPa for 0.5-3 h, cooling the polyester or polyether glycol until the temperature of the polyester or polyether glycol reaches 50 DEG C, adding polyisocyanate and polar solvents into the polyester or polyether glycol, carrying out stirring reaction at the temperatures of 60-120 DEG C for 2-14 h and cooling first reaction products until the temperatures of the first reaction products reach 50 DEG C; adding chain extenders with disulfide bonds, hyperbranched structures and active hydrogen atoms into the first reaction products, continuing to carry out reaction at the temperatures of 60-120 DEG C for 2-14 h, uniformly mixing second reaction products and organic silver salt solution with one another and carrying out reduced pressure distillation to obtain the conductive ink composition with the self-repair functions. The conductive ink composition with the self-repair functions, the method and the application have the advantages that self-repair can be carried out under heating and UV (ultraviolet) light illumination conditions, the conductive ink composition is free of mixed particles, the solid content of silver can be obviously increased, and the uniformity of ink can be obviously improved; the conductive ink can be used for writing on base materials such as paper, glass and plastics in writing brush and silk-screen printing modes and the like, and the conductive ink composition is excellent in conductivity by means of formaldehyde solution reduction and is suitable for flexible circuits.

Description

technical field [0001] The invention belongs to the technical field of self-repair of electronic materials, and in particular relates to a conductive ink composition with self-repair function and its preparation method and application. Background technique [0002] With the development of electronic components in the direction of flexibility, miniaturization, wearable and low cost, the demand for circuits based on flexible materials such as plastics, paper, and fabrics is also increasing. Simple direct writing of flexible circuits in imitation of a writing brush has become a convenient means of connecting electronic devices. At present, the development of conductive ink mainly utilizes the composite of conductive nanoparticles and polymer surfactants, and the content of nanoparticles is low and post-sintering treatment is required. At the same time, flexible circuits are inevitably susceptible to external mechanical damage during the production and use process, shortening t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/52C09D11/102C09D11/16C08G18/32
Inventor 赵松方周森浩许智鹏曹笃霞冷金凤杨洋
Owner UNIV OF JINAN
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