Novel anode electroplating liquid and acidic copper electroplating process using same

Abstract

The invention discloses a novel anode electroplating liquid which comprises 5-240 g / L of copper sulfate, 50-220 g / L of sulfuric acid and 0.01%-150 g / L of a reducing agent. When the anode electroplating liquid is used for electroplating production, an excellent-quality electroplating product can be obtained without using phosphor copper as an electroplating anode, and toxic phosphorus wastewater is prevented from being generated in the electroplating process. The invention further discloses an acidic copper electroplating process using the novel anode electroplating liquid.

Description

technical field [0001] The invention belongs to the field of electroplating copper, in particular to a novel anode electroplating solution and an acid electroplating copper process using the electroplating solution Background technique [0002] The acid phosphor copper electroplating copper process is an acid electroplating copper process that is often used in mass production at present. The process usually uses copper element or copper alloy doped with phosphorus, that is, phosphorus copper, as the anode, the conductive plated part as the cathode, and an acidic copper sulfate solution whose main components are copper sulfate and sulfuric acid as the electroplating solution. The acid phosphor copper electroplating process specifically includes the following steps: [0003] 1. Preparation of electroplating: Prepare the power supply and electroplating solution according to the process requirements, and place the cathode plated parts and the anode in the same electroplating so...

AI Technical Summary

Problems solved by technology

The copper element will stick to the cathode plating layer, causing problems such as burrs and roughness on the plating layer, so that the electroplated products cannot meet the quality requirements;

[0017] (2) Anode passivation, that is, the oxidized part of the copper surface cannot undergo electrochemical reactions; this leads to uneven dissolution of the anode and unstable components of the electroplating solution

[0019] 1. The price of phosphor copper is about 15-20% more expensive than copper, and the cost of use is high;

[0020] 2. Phosphor copper will be partially dissolved in the electroplating solution during the electroplating process, resulting in highly toxic phosphorus-containing wastewater, which will

[0022] To bear the high cost of electroplating waste treatment

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