Novel anode electroplating liquid and acidic copper electroplating process using same

An anodic electroplating solution and acid electroplating technology, which is applied in the electrolytic process, electrolytic components, cells, etc., can solve the problems that the electroplating products cannot meet the quality requirements, the high cost of electroplating waste liquid treatment, and the unstable composition of the electroplating liquid, etc., to avoid the edge Increased effect, low cost of environmental protection treatment, avoiding the effect of large pressure on the electroplating tank

Inactive Publication Date: 2017-06-13
叶旖婷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper element will stick to the cathode plating layer, causing problems such as burrs and roughness on the plating layer, so that the electroplated products cannot meet the quality requirements;
[0017] (2) Anode passivation, that is, the oxidized part of the copper surface cannot undergo electrochemical reactions; this leads to uneven dissolution of the anode and unstable components of

Method used

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  • Novel anode electroplating liquid and acidic copper electroplating process using same
  • Novel anode electroplating liquid and acidic copper electroplating process using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] The components of the anolyte plating solution and the catholyte plating solution used in this example are shown in Table 1.

[0072] Step 1: Dissolve the components specified in Table 1 in water according to the proportioning ratio, and prepare anodic plating solution and cathodic plating solution respectively; use a diaphragm to separate the electroplating tank into a cathode tank and an anode tank, and an insoluble anode plate is provided at the bottom of the anode tank;

[0073] Step 2: Pour the anode plating solution obtained in step 1 into the anode tank of the electroplating tank, pour the cathodic plating solution into the cathode tank of the electroplating tank, and weigh the initial weight of the cathodic plated piece, and measure its weight to be 500.5g;

[0074] Step 3: Put phosphorus-free copper powder into a titanium metal hanging basket, and wrap the titanium metal hanging basket with a chemical fiber cloth bag as an anode; immerse the anode in the anode p...

Embodiment 2

[0077] The components of the anolyte plating solution and the catholyte plating solution used in this example are shown in Table 1.

[0078] The steps of this embodiment are the same as those of Embodiment 1. The initial weight of the cathode-plated piece measured in step 1 is 499.7g, and after the electroplating finishes, the measured plated piece weighs 1834.3g.

Embodiment 3

[0080] The components of the anolyte plating solution and the catholyte plating solution used in this example are shown in Table 1.

[0081] The steps of this embodiment are the same as those of Embodiment 1. The initial weight of the cathodic plated piece measured in step 1 is 500.2g, and after the electroplating finishes, the measured plated piece weighs 1820.4g.

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Abstract

The invention discloses a novel anode electroplating liquid which comprises 5-240 g/L of copper sulfate, 50-220 g/L of sulfuric acid and 0.01%-150 g/L of a reducing agent. When the anode electroplating liquid is used for electroplating production, an excellent-quality electroplating product can be obtained without using phosphor copper as an electroplating anode, and toxic phosphorus wastewater is prevented from being generated in the electroplating process. The invention further discloses an acidic copper electroplating process using the novel anode electroplating liquid.

Description

technical field [0001] The invention belongs to the field of electroplating copper, in particular to a novel anode electroplating solution and an acid electroplating copper process using the electroplating solution Background technique [0002] The acid phosphor copper electroplating copper process is an acid electroplating copper process that is often used in mass production at present. The process usually uses copper element or copper alloy doped with phosphorus, that is, phosphorus copper, as the anode, the conductive plated part as the cathode, and an acidic copper sulfate solution whose main components are copper sulfate and sulfuric acid as the electroplating solution. The acid phosphor copper electroplating process specifically includes the following steps: [0003] 1. Preparation of electroplating: Prepare the power supply and electroplating solution according to the process requirements, and place the cathode plated parts and the anode in the same electroplating so...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D17/00
CPCC25D3/38C25D17/002
Inventor 叶旖婷
Owner 叶旖婷
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