Long-service life and high-reliability high-voltage varistor
A varistor, reliability technology, applied in the direction of varistor, resistor shell/packaging shell/potting, etc., can solve the problem of low-resistance without considering the long-life and high-reliability requirements of computers, and without considering the aging protection of electrical insulation. Voltage requirements and other issues, to achieve the effect of large economic use value, avoid thermal damage, high on-voltage and low residual voltage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] Such as figure 1 with figure 2 As shown, this embodiment provides a long-life high-reliability high-voltage varistor, including an insulating sleeve 1, a lower end cover 2, an upper end cover 3, an electrode splint 4, an MOV chip set 5, a lower discharge electrode 6, an insulating Ring piece 7, upper discharge electrode 8, insulating bolt 9,
[0034] In this embodiment, the insulating sleeve 1 is provided with 10 inside,
[0035] In this embodiment, the lower end cover 2 is composed of a lower end cover base 21 and a lower end cover boss 22, and the lower end cover boss 22 is provided with threads 10 and bolt fixing holes 11,
[0036] In this embodiment, the upper end cap 3 is composed of an upper end cap base 31 and an upper end cap boss 32, and the upper end cap boss 32 is provided with threads 10,
[0037] The electrode splint 4 is also provided with bolt fixing holes 11,
[0038] The MOV chipset 5 is composed of at least one MOV chip 51. In this embodiment, the...
Embodiment 2
[0047] The difference between this embodiment and embodiment 1 is:
[0048] Such as image 3 with Figure 4 As shown, in the present embodiment, an insulating board 12, a long connecting piece 13 and a short connecting piece 14 are also included, and the MOV chip set 5 includes a first MOV chip set 51 and a second MOV chip set 52, the first MOV chip set 51 comprises MOV chip 51A, MOV chip 51B and MOV chip 51C, and the second MOV chip group 52 comprises MOV chip 52A, MOV chip 52B and MOV chip 52C, and described first MOV chip group 51 is installed on described lower bottom end cap convex On the stage 22, an insulating plate 12, a lower discharge electrode 6, an insulating ring sheet 7 and an upper discharge electrode 8 are installed in sequence on the first MOV chip group 51, and one end of the short connecting piece 14 is inserted into the first MOV chip Between the group 51 and the insulating plate 12, the other end is inserted between the upper discharge electrode 8 and th...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



