Semiconductor device and method for improving semiconductor device performance

A technology for semiconductors and devices, applied in the field of semiconductor manufacturing, can solve the problem that the carrier mobility of semiconductor devices needs to be improved, and achieve the effects of improving carrier mobility, increasing stress and improving performance.

Active Publication Date: 2017-06-13
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The introduction of embedded germanium silicon technology or embedded carbon silicon technology can improve the carrier mobility of semiconductor devices to a certain extent, but in practical applications, it is found that the carrier mobility of semiconductor devices still needs to be improved

Method used

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  • Semiconductor device and method for improving semiconductor device performance
  • Semiconductor device and method for improving semiconductor device performance
  • Semiconductor device and method for improving semiconductor device performance

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Embodiment Construction

[0034] It can be seen from the background art that the carrier mobility of semiconductor devices formed in the prior art needs to be improved.

[0035] It has been found through research that square grooves or U-shaped grooves are usually formed in the fins on both sides of the gate structure, and then the square grooves or U-shaped grooves are filled with stress layers. The stress exerted by the stress layer in the groove is limited to the channel region, so that the improvement of carrier mobility of the correspondingly formed semiconductor device is limited.

[0036]In order to enhance the stress exerted by the stress layer on the channel region, square grooves or U-shaped grooves are usually isotropically etched. It is expected to form a sigma-shaped depression on the sidewall of the groove. However, the formed sigma-shaped The recesses tend to adversely affect the size of the channel region below the gate structure, so that the stress effect of the formed stress layer on ...

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Abstract

The invention discloses a semiconductor device and a method for improving semiconductor device performance. The method for improving semiconductor device performance comprises the following steps: an amorphousizing ion implantation is carried out on substrates on both sides of a gate structure to form amorphous layers, wherein the amorphous layers comprise first amorphous layers, second amorphous layers and third amorphous layers, and the first amorphous layers are located within a portion of the substrates below the gate structure; the second amorphous layers and the substrates with a second thickness located below the second amorphous layers are removed by etching, first grooves are formed in the amorphous layers, and second grooves and third grooves penetrating each other are formed below the first grooves; the third grooves are filled with an organic material layer; sidewalls of the second grooves are etched to form sigma-shaped dips; and the first grooves, the second grooves with the sigma-shaped dips and the third grooves are filled with a stress layer. According to the invention, the stress in the channel region is increased, the carrier mobility of the semiconductor device is improved and the electrical performance of the semiconductor device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor device and a method for improving the performance of the semiconductor device. Background technique [0002] With the continuous development of semiconductor technology, carrier mobility enhancement technology has been widely studied and applied. Improving the carrier mobility in the channel region can increase the driving current of MOS devices and improve the performance of the devices. [0003] In the existing manufacturing process of semiconductor devices, since stress can change the energy gap and carrier mobility of silicon materials, it has become an increasingly common means to improve the performance of MOS transistors through stress. Specifically, by properly controlling the stress, the mobility of carriers (electrons in NMOS transistors and holes in PMOS transistors) can be increased, thereby increasing the driving current, thereby g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/336H01L29/78
CPCH01L29/66477H01L29/7842
Inventor 李勇
Owner SEMICON MFG INT (SHANGHAI) CORP
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