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A modified polyphenylene ether material with low dielectric loss and high thermal conductivity and its preparation method

A technology of polyphenylene ether and low dielectric, applied in the field of polyphenylene ether materials and its preparation, can solve the problems of poor thermal conductivity, no thermal conductivity modification, and failure to meet electronic communication components, etc., achieve good lubrication performance and reduce screw wear , Improve the effect of uneven mixing

Active Publication Date: 2019-10-18
SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the relatively poor thermal conductivity of the material itself and the lack of corresponding thermal conductivity modification in this patent, the product cannot meet the requirements of electronic communication components for high thermal conductivity

Method used

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  • A modified polyphenylene ether material with low dielectric loss and high thermal conductivity and its preparation method
  • A modified polyphenylene ether material with low dielectric loss and high thermal conductivity and its preparation method
  • A modified polyphenylene ether material with low dielectric loss and high thermal conductivity and its preparation method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Take the raw materials of each component in the following parts by weight: 55 parts of polyphenylene ether, 5 parts of high-impact polystyrene, 5 parts of SEBS, 5 parts of hollow glass microspheres, 30 parts of boron nitride, 1 part of OP wax, Antioxidant 1010 0.1 part, antioxidant 168 0.2 part.

[0028] (2) First add boron nitride and OP wax to a 100°C high-mixer, stir at a high speed for 10 minutes to obtain pretreated boron nitride, and then pass the rest of the raw materials except hollow glass microspheres and pretreated boron nitride through a high-mixer High-speed mixing, the speed of the high-speed mixer is 800-1000rpm, the mixing temperature is 40°C, and mixing for 10 minutes; the mixed material is added to the twin-screw extruder, and hollow glass microspheres are added from the side feeding port at the same time to control the temperature of each area At 260-290°C, the strands can be cut into pellets to obtain the product.

Embodiment 2

[0030] (1) Weigh the raw materials of each component according to the following parts by weight: 25 parts of polyphenylene ether, 25 parts of high-impact polystyrene, 5 parts of SBS, 5 parts of hollow glass microspheres, 40 parts of aluminum nitride, and 3 parts of PE wax , 0.1 part of antioxidant 1010, 0.1 part of antioxidant 168;

[0031] (2) First add aluminum nitride and PE wax to a high-mixer at 130°C, and stir at a high speed for 5 minutes to obtain pretreated aluminum nitride, and then pass the rest of the raw materials except hollow glass microspheres and pre-treated aluminum nitride through a high-mixer Mix at a high speed, control the speed of the high-speed mixer to 800-1000rpm, mix the temperature at 60°C, and mix for 3 minutes; pass the mixed material through the twin-screw extruder, and simultaneously add hollow glass microspheres from the side feeding port to control the temperature of each zone At 240-275°C, extruder strands can be cut into pellets to obtain th...

Embodiment 3

[0033] (1) Weigh each component raw material according to the following parts by weight: 20 parts of polyphenylene ether, 14 parts of high-impact polystyrene, 10 parts of SEBS-g-MAH, 6 parts of hollow glass microspheres, 50 parts of aluminum oxide, silicon 2 parts of ketone, 0.2 part of antioxidant 1010, 0.3 part of antioxidant 168;

[0034] (2) First add alumina and silicone to a high-mixer at 120°C and stir at a high speed for 15 minutes to obtain pretreated alumina, then mix the other raw materials and pretreated alumina except hollow glass microspheres through a high-speed mixer , the speed of the high-speed mixer is 800-1000rpm, the mixing temperature is 50°C, and the mixing time is 6 minutes; the mixed material is passed through the twin-screw extruder, and hollow glass microspheres are added from the side feeding port at the same time, and the temperature in each zone is controlled at 250- 280°C, the strands can be cut into pellets to obtain the product.

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Abstract

The invention relates to a low-dielectric-loss and high heat-conducting modified polyphenylene oxide material and a preparation method thereof. The modified polyphenylene oxide material is prepared from, by weight, 20-55 parts of polyphenylene oxide, 5-25 parts of polystyrene, 5-10 parts of flexibilizers, 35-65 parts of filler, 1-3 parts of lubricants and 0.2-0.5 part of antioxidant. The modified polyphenylene oxide material is prepared in the following steps of (1) weighing the filler and the lubricants, obtaining premixed heat-conducting filler after premixing heat-conducting filler in the filler with the lubricants; (2) weighing polyphenylene, polystyrene, the flexibilizers and the antioxidant, mixing the four weighed materials evenly with the premixed heat-conducting filler, and obtaining a mixture; (3) adding the mixture into a screw extruding machine, meanwhile, feeding low-dielectric filler into the screw extruding machine from a side feed inlet, conducting treatment of melt extrusion, stretch and granulation on the low-dielectric filler, and obtaining the target product. Compared with the prior art, the low-dielectric-loss and high heat-conducting modified polyphenylene oxide material has the advantages of good processing performances, high heat-conducting properties, low dielectric losses and the like.

Description

technical field [0001] The invention relates to a polyphenylene ether material and a preparation method thereof, in particular to a modified polyphenylene ether material with low dielectric loss and high thermal conductivity and a preparation method thereof. Background technique [0002] With the continuous development of industrial production and science and technology, people have higher and higher requirements for the comprehensive performance of thermal conductive materials, and traditional metal materials can no longer meet the requirements of some special occasions. For example, the rapid accumulation and increase of heat generated by electronic equipment will cause the device to malfunction, so timely heat dissipation has become an important factor affecting its life. Therefore, it is urgent to develop thermally conductive insulating materials with high reliability and high heat dissipation performance to replace traditional materials. Thermally conductive polymer ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L51/04C08L53/02C08L51/00C08K13/06C08K9/04C08K7/28C08K3/38C08K3/28C08K5/134C08K5/526
Inventor 杨桂生赵亚囡李兰杰
Owner SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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