Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Liquid metal thermal interface material with self-gain performance

A technology of thermal interface material and liquid metal, which is applied in the direction of heat exchange materials, metal layered products, semiconductor/solid device components, etc., can solve problems such as side leakage of liquid metal, large increase in fluidity, short circuit of circuit board, etc. , to achieve low production costs, simple processing and smelting methods, and prevent side leakage

Active Publication Date: 2017-07-18
NINGBO SYRNMA METAL MATERIALS CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This feature makes the fluidity of liquid metal as a thermal interface material increase greatly with the increase of temperature, and side leakage will occur when liquid metal is used as a thermal interface material, and the circuit board will be short-circuited due to the conductivity of liquid metal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A liquid metal composite thermal interface material structure for heat dissipation at 80°C. By weight percentage, the composition of the alloy is: Zn: 2.1%, Bi: 2.4%, Sn: 10.5%, Au: 0.3%, V: 0.1%, the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot is cold-rolled, and the rolling reduction in each pass is 25%, and the cold-rolling is 0.15mm. The second phase particles are selected to be a compound composed of Cu, Ti and N, and the particle size is 25 microns. The thickness of the layer with particles accounts for 10% of the total thickness, that is, the upper and lower parts account for 5% of the total thickness respectively. The volume fraction of the second phase particles in the layer is 5%. After ultrasonically dispersin...

Embodiment 2

[0020] A liquid metal composite thermal interface material structure for heat dissipation at 120°C. The composition of the alloy is: Zn: 3.1%, Bi: 2.8%, Sn: 16.4%, Au: 0.4%, V: 0.1%, the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot is cold-rolled, and the rolling reduction in each pass is 20%, and the cold-rolling is 0.15mm. The second phase particles are selected as a compound composed of Cu, Mo and O, and the particle size is 30 microns. The thickness of the layer with particles accounts for 10% of the total thickness, that is, the upper and lower parts account for 5% of the total thickness respectively. The volume fraction of the second phase particles in the layer is 8%. After ultrasonically dispersing the second-phase parti...

Embodiment 3

[0022] A liquid metal composite thermal interface material structure for heat dissipation at 160°C. The composition of the alloy is: Zn: 3.8%, Bi: 5.2%, Sn: 35.6%, Au: 0.4%, V: 0.1%, the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420°C, and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot is cold-rolled, and the rolling reduction in each pass is 25%, and the cold-rolling is 0.15mm. The second phase particles are selected as a compound composed of Cu, W and N, and the particle size is 30 microns. The thickness of the layer with particles accounts for 10% of the total thickness, that is, the upper and lower parts account for 5% of the total thickness respectively. The volume fraction of the second phase particles in the layer is 5%. After ultrasonically dispersing the second-phase particle...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a liquid metal thermal interface material with self-gain performance. The liquid metal thermal interface material is of a three-layer structure. The middle layer is composed of, by weight, 1.0%-4.0% of Zn, 2.0%-6.0% of Bi, 10.0%-40.0% of Sn, 0.3%-0.8% of Au, 0.1%-0.2% of V and the balance In. Each of the upper layer and the lower layer comprises second-phase particles besides the alloy components mentioned above. The second-phase particles are compounds formed by combining Cu, Ti, Mo and W with O, N, S and P. The obtained product can keep in the solid state under the normal work state of the thermal interface material while the high heat conduction rate (20-85 W / m.K) of the liquid metal thermal interface material is kept, and therefore micrometer pores in surfaces of a heating body and a cooling body are effectively filled. Under the condition that liquid metal works in the solid state, side leakage is fundamentally eradicated.

Description

technical field [0001] The invention relates to a liquid metal material, in particular to a liquid metal thermal interface material with self-gain performance. Background technique [0002] As we all know, IGBT devices have become the mainstream devices in the development of power semiconductor devices today due to their high input resistance, fast switching speed, low on-state voltage, high blocking voltage, and large current. They are widely used in various AC motors, In the power electronic circuit of frequency converter, switching power supply, lighting circuit, traction drive and other fields. When the IGBT device is working, the heat generated will cause the chip temperature to rise rapidly beyond the maximum allowable IGBT junction temperature. Therefore, the performance of the IGBT will be greatly reduced, and cannot work stably, resulting in performance degradation or failure. Due to the further development of IGBT technology in recent years, the related high-effi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22C28/00C22C32/00C22F1/16C09K5/14H01L23/373H01L23/473B32B15/01
CPCC22C28/00B32B15/01B32B2250/03B32B2255/06B32B2255/20B32B2255/205B32B2307/302B32B2311/16B32B2311/18B32B2311/20C09K5/14C22C32/001C22C32/0068C22F1/16H01L23/3736H01L23/473
Inventor 刘亚军曹贺全曹帅郭强吴智鑫
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com