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A copper foam composite liquid metal thermal interface material

A thermal interface material, liquid metal technology, applied in heat exchange materials, semiconductor/solid-state device components, chemical instruments and methods, etc., can solve the problems of liquid metal side leakage, large increase in fluidity, short circuit of circuit boards, etc. , to achieve the effect of low production cost, simple processing and smelting method, and good heat dissipation performance

Active Publication Date: 2019-02-26
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This feature makes the fluidity of liquid metal as a thermal interface material increase greatly with the increase of temperature, and side leakage will occur when liquid metal is used as a thermal interface material, and the circuit board will be short-circuited due to the conductivity of liquid metal

Method used

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  • A copper foam composite liquid metal thermal interface material
  • A copper foam composite liquid metal thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A liquid metal thermal interface material with syntactic copper foam for heat dissipation at 80°C. By weight percentage, Zn: 2.4%, Sb: 1.6%, Sn: 5.7%, Ag: 0.4%, Ce: 0.1%, Ru: 0.02%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then the molten liquid metal is poured into the foamed copper for infiltration under the action of gravity, and the density of the foamed copper is controlled at 22%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05 mm. In this embodiment, the melting point of the liquid metal is 85°C. The thermal conductivity of the thermal interface material is 95W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 80°C.

Embodiment 2

[0026] A liquid metal thermal interface material with composite foam copper for heat dissipation at 120°C. By weight percentage, Zn: 6.3%, Sb: 2.4%, Sn: 8.6%, Ag: 0.6%, Ce: 0.1%, Ru: 0.02%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then the molten liquid metal is cast into foamed copper for infiltration under gravity, and the density of foamed copper is controlled at 26%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05 mm. In this embodiment, the melting point of the liquid metal is 128°C. The thermal conductivity of the thermal interface material is 93W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 120°C.

Embodiment 3

[0028] A liquid metal thermal interface material with syntactic copper foam for heat dissipation at 180°C. By weight percentage, Zn: 7.9%, Sb: 3.8%, Sn: 10.6%, Ag: 0.6%, Ce: 0.2%, Ru: 0.03%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then the molten liquid metal is cast into foamed copper for infiltration under gravity, and the density of foamed copper is controlled at 28%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05 mm. In this embodiment, the melting point of the liquid metal is 186°C. The thermal conductivity of the thermal interface material is 87W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 180°C.

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Abstract

The invention discloses a foamy copper-compounded liquid metal thermal interface material. The material is prepared from a liquid metal thermal interface material and foamy copper, and the liquid metal thermal interface material is prepared from, by weight, 2.0%-8.0% of Zn, 1.0%-4.0% of Sb, 5.0%-12.0% of Sn, 0.3%-0.8% of Ag, 0.1%-0.2% of Ce, 0.02%-0.04% of Ru and the balance In. The side leakage phenomenon of liquid metal is effectively controlled through the porous structure of foamy copper and can be completely and thoroughly eradicated by combining the melting point of liquid metal and the pore size of foamy copper, and therefore an effective solution is provided for large-scale commercial application of the liquid metal thermal interface material.

Description

technical field [0001] The invention relates to liquid metal, in particular to a foam copper composite liquid metal thermal interface material. Background technique [0002] As we all know, IGBT devices have become the mainstream devices in the development of power semiconductor devices today due to their high input resistance, fast switching speed, low on-state voltage, high blocking voltage, and large current. They are widely used in various AC motors, In the power electronic circuit of frequency converter, switching power supply, lighting circuit, traction drive and other fields. When the IGBT device is working, the heat generated will cause the chip temperature to rise rapidly beyond the maximum allowable IGBT junction temperature. Therefore, the performance of the IGBT will be greatly reduced, and cannot work stably, resulting in performance degradation or failure. Due to the further development of IGBT technology in recent years, the related high-efficiency heat diss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D23/04C09K5/10C22C28/00H01L23/373H01L23/473
Inventor 刘亚军曹贺全曹帅郭强吴智鑫
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
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