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Packaging structure, manufacturing method and application thereof

A manufacturing method and packaging structure technology, applied in the field of materials, to achieve the effects of avoiding damage, simple steps, and easy realization

Active Publication Date: 2017-07-28
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a packaging structure, its manufacturing method and its application, so as to solve the problem that the packaging material made by the manufacturing method in the prior art cannot achieve the performance of barrier water vapor and aging resistance while having flexibility.

Method used

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  • Packaging structure, manufacturing method and application thereof
  • Packaging structure, manufacturing method and application thereof
  • Packaging structure, manufacturing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:

[0062] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;

[0063] forming a water vapor barrier layer made of silicon oxide on the first surface of the flexible substrate layer through an evaporation process, and the thickness of the water vapor barrier layer is 50nm;

[0064] Mixing a tetrafluoroethylene-containing solution and an isocyanate-based curing agent to prepare a fluororesin coating solution for the fluororesin layer, and using a coating machine to coat the second surface of the flexible substrate layer to a desired thickness , followed by drying the coating solution coated on the water vapor barrier layer at a high temperature to obtain a fluoride layer with a thickness of 50 μm.

Embodiment 2

[0066] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:

[0067] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;

[0068] Coating the monomer of ethylene glycol diacrylate on the first surface of the flexible substrate layer by roller coating, and then drying to remove the solvent to form a pre-treatment layer, the thickness of the pre-treatment layer is 80nm;

[0069] The inorganic nano-ceramic coating is coated on the surface of the pre-treatment layer by roller coating and cured to form a hardened coating, the thickness of the hardened coating is 4 μm;

[0070] A water vapor barrier layer made of silicon oxide is formed on the surface of the hardened coating by an evaporation process, and the thickness of the water vapor barrier layer is 50nm;

[0071...

Embodiment 3

[0073] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:

[0074] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;

[0075] Coating the monomer of ethylene glycol diacrylate on the first surface of the flexible substrate layer by roller coating, and then drying to remove the solvent to form a pre-treatment layer, the thickness of the pre-treatment layer is 80nm;

[0076] The inorganic nano-ceramic coating is coated on the surface of the pre-treatment layer by roller coating and cured to form a hardened coating, the thickness of the hardened coating is 4 μm;

[0077] A water vapor barrier layer made of silicon oxide is formed on the surface of the hardened coating by an evaporation process, and the thickness of the water vapor barrier layer is 50nm;

[0078...

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Abstract

The invention provides a packaging structure, a manufacturing method and application thereof. The manufacturing method comprises the following steps of manufacturing a flexible substrate layer with a first surface and a second surface which oppositely arranged; forming a steam blocking layer on the first surface of the flexible substrate layer; and forming a fluoride layer on the second surface of the flexible substrate layer. According to the manufacturing method, because the flexible substrate layer is manufactured from a flexible transparent material, and the steam blocking layer and the fluoride layer are formed at two sides of the flexible substrate layer, a packaging material has high steam blocking performance, high aging resistance and high flexibility. Compared with a traditional packaging structure in which the steam blocking layer and the fluoride layer are formed at one side of the flexible substrate layer, because the flexible substrate layer is arranged between the steam blocking layer and the fluoride layer and the flexible substrate layer has relatively large thickness, the packaging structure has advantages of more effectively protecting the steam blocking layer, improving aging resistance of the packaging structure and effectively keeping steam blocking performance of the packaging structure.

Description

technical field [0001] The present invention relates to the field of material technology, in particular, to a packaging structure, its manufacturing method and its application. Background technique [0002] In recent years, energy problems have become increasingly prominent, and new energy sources have developed rapidly. As a relatively important renewable energy source, solar energy has attracted more and more attention and has been used on a large scale. The current traditional solar power generation technology is crystalline silicon cell technology, which converts sunlight energy into electrical energy by forming a crystalline silicon solar power generation panel. However, crystalline silicon battery technology also has some shortcomings, mainly because its photoelectric conversion efficiency is already approaching its theoretical limit, and there is not much room for improvement. In addition, the brittle nature of silicon materials also prevents it from being flexible an...

Claims

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Application Information

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IPC IPC(8): H01L51/44H01L51/48H01L31/048H01L31/18H01L27/32
CPCH01L31/048H01L31/18H10K59/00H10K30/88Y02E10/549Y02P70/50
Inventor 于甄陈海力李硕
Owner ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL