Packaging structure, manufacturing method and application thereof
A manufacturing method and packaging structure technology, applied in the field of materials, to achieve the effects of avoiding damage, simple steps, and easy realization
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Embodiment 1
[0061] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:
[0062] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;
[0063] forming a water vapor barrier layer made of silicon oxide on the first surface of the flexible substrate layer through an evaporation process, and the thickness of the water vapor barrier layer is 50nm;
[0064] Mixing a tetrafluoroethylene-containing solution and an isocyanate-based curing agent to prepare a fluororesin coating solution for the fluororesin layer, and using a coating machine to coat the second surface of the flexible substrate layer to a desired thickness , followed by drying the coating solution coated on the water vapor barrier layer at a high temperature to obtain a fluoride layer with a thickness of 50 μm.
Embodiment 2
[0066] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:
[0067] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;
[0068] Coating the monomer of ethylene glycol diacrylate on the first surface of the flexible substrate layer by roller coating, and then drying to remove the solvent to form a pre-treatment layer, the thickness of the pre-treatment layer is 80nm;
[0069] The inorganic nano-ceramic coating is coated on the surface of the pre-treatment layer by roller coating and cured to form a hardened coating, the thickness of the hardened coating is 4 μm;
[0070] A water vapor barrier layer made of silicon oxide is formed on the surface of the hardened coating by an evaporation process, and the thickness of the water vapor barrier layer is 50nm;
[0071...
Embodiment 3
[0073] The manufacturing method of the packaging structure provided in this embodiment includes the following steps:
[0074] The production material is a flexible substrate layer of PET, the thickness of the flexible substrate layer is 50 μm, and the flexible substrate layer has a first surface and a second surface oppositely arranged;
[0075] Coating the monomer of ethylene glycol diacrylate on the first surface of the flexible substrate layer by roller coating, and then drying to remove the solvent to form a pre-treatment layer, the thickness of the pre-treatment layer is 80nm;
[0076] The inorganic nano-ceramic coating is coated on the surface of the pre-treatment layer by roller coating and cured to form a hardened coating, the thickness of the hardened coating is 4 μm;
[0077] A water vapor barrier layer made of silicon oxide is formed on the surface of the hardened coating by an evaporation process, and the thickness of the water vapor barrier layer is 50nm;
[0078...
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Abstract
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