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Micro hemisphere resonant gyro based on SOI (Silicon-On-Insulator) encapsulation and processing method thereof

A hemispherical resonant gyroscope and hemispherical shell technology are applied in the fields of micro-electromechanical and inertial navigation, which can solve the problems of complex packaging, and achieve the effects of high support strength, increased facing area, and improved gyro accuracy.

Active Publication Date: 2017-08-18
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The MEMS packaging process has always been a difficult point in the manufacture of MEMS devices. Due to the complex and diverse structures and functions of MEMS devices, and various environmental parameters, their packaging is far more complicated than IC packaging, and there is no unified standard

Method used

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  • Micro hemisphere resonant gyro based on SOI (Silicon-On-Insulator) encapsulation and processing method thereof
  • Micro hemisphere resonant gyro based on SOI (Silicon-On-Insulator) encapsulation and processing method thereof
  • Micro hemisphere resonant gyro based on SOI (Silicon-On-Insulator) encapsulation and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] like Figure 1-3As shown, a micro hemispherical resonant gyroscope based on SOI package, including glass substrate, micro hemispherical shell resonator, two reference voltage lead posts, electrodes, SOI sealing wall, upper layer of SOI silicon wafer, silicon dioxide Layer, first electrode hole, second electrode hole, spherical shell support handle, circular metal electrode area and metal lead; the upper layer of the SOI crystal silicon wafer is set above the glass substrate, and the silicon dioxide layer is set on the SOI crystal On the bottom surface of the upper layer of the silicon wafer, the SOI sealing wall is set between the silicon dioxide layer and the glass substrate to form a closed space structure. The support handle of the spherical shell is bonded on the glass substrate, and the number of electrodes is 16, which are evenly distributed on the lower surface of the silicon dioxide layer above the lip edge of the micro-hemispherical shell; two reference voltage...

Embodiment 2

[0054] It is basically the same as the embodiment 1, except that the diameter of the hemispherical shell resonator is 1200 μm and the thickness is 5 μm; the gap between the hemispherical shell resonator and the electrode is 20 μm.

Embodiment 3

[0056] Basically the same as Example 1, the difference is: in step (3), gold or tin are deposited on the lower surface of the SOI silicon wafer, and in step (12), by gold-gold bonding or gold-tin bonding, Complete the package.

[0057] The manufacture of the gyroscope in the invention combines the MEMS bulk silicon processing technology, the surface micro-processing technology and the bonding technology.

[0058] The preparation of the micro-hemispherical shell of the present invention and the processing technology of processing the electrode and the sealing wall on the SOI silicon wafer are independent of each other, and can be processed at the same time, and then gold-silicon bonding / gold-tin bonding / gold-gold bonding are performed in a vacuum environment The process realizes the preparation of the micro-hemispherical resonant gyroscope. The invention cleverly utilizes the characteristics of the SOI silicon wafer to realize the vacuum packaging of the gyroscope, and has sim...

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Abstract

The invention discloses a micro hemisphere resonant gyro based on SOI (Silicon-On-Insulator) encapsulation and a processing method thereof. The micro hemisphere resonant gyro based on SOI encapsulation comprises a glass substrate, a micro hemisphere shell harmonic oscillator, two reference voltage wire leading posts, an electrode, an SOI sealing wall, an SOI crystalline silicon wafer upper layer, a silicon dioxide layer, a first electrode hole, a second electrode hole, a spherical shell support handle, a round metal electrode region and a metal lead wire. The electrode is positioned right above the spherical shell lip edge; the defect of inconsistent capacitive gap size due to bonding alignment precision during the assembly bonding is avoided; the processing error is reduced; the gyro precision is improved. The processing method of the micro hemisphere resonant gyro based on SOI encapsulation has the advantages that the advantages of the SOI wafers are sufficiently utilized, so that the encapsulation of the whole gyro is greatly simplified; the height and the diameter of the spherical shell handle can be easily controlled; in addition, the support intensity is high; collapse cannot easily occur.

Description

technical field [0001] The invention relates to the field of micro-electromechanical and inertial navigation, in particular to a micro-hemispherical resonant gyroscope based on SOI packaging and a processing method thereof. Background technique [0002] With the development of 3-D MEMS (micro-electro-mechanical systems), the unique advantages of traditional hemispherical resonant gyroscopes, and the development trend of miniaturization of strapdown inertial navigation systems, the research of micro-hemispherical resonant gyroscopes has attracted many scientific research. people's attention. [0003] At present, the processing of the hemispherical shell resonator and electrodes of the micro-hemispherical resonant gyroscope is divided into integral type and assembled type. The integrated processing scheme means that the micro-hemispherical shell resonator and electrodes are processed on the same silicon wafer. The assembled processing scheme means that the micro-hemispherica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/56G01C25/00
CPCG01C19/56G01C25/00
Inventor 夏敦柱高海钰
Owner SOUTHEAST UNIV
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