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Method for solving problem of uneven sawtooth-shaped circuit of thin board

A circuit and dog tooth technology, which is applied to the removal of conductive materials by chemical/electrolytic methods, printed circuits, and printed circuit manufacturing, etc. To achieve the effect of preventing dog teeth problems

Inactive Publication Date: 2017-08-18
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the thin plate with a thickness of <1.0mm is prone to line dog teeth when making the outer circuit, the present invention provides a method to solve the problem of thin plate line dog teeth. The bonding force between the circuit board and the dry film prevents tin seepage during electroplating to solve the problem of line dog teeth

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] This embodiment provides a thin plate manufacturing method, especially a method for solving thin plate line dog teeth with a plate thickness <1.0mm, and the specific steps are as follows:

[0021] (1) Production boards that have undergone sinking copper and full-board electroplating processes:

[0022] According to the existing technology, the base material is made into a semi-finished production board by sequentially going through material cutting→making inner layer circuit→pressing→drilling→drilling copper→full board electroplating; the details are as follows:

[0023] a. Cutting: Cut out the core board according to the panel size 520mm×620mm, and the thickness of the core board is 0.5mmH / H.

[0024] b. Making the inner layer circuit (negative film process): use a vertical coating machine to produce, the film thickness is controlled to 8μm, use a fully automatic exposure machine, and use 5-6 grid exposure rulers (21 grid exposure rulers) to complete the inner layer ci...

Embodiment 2

[0040] This embodiment provides a thin-plate manufacturing method, especially a method for solving thin-plate circuit dog teeth with a plate thickness <1.0mm. This method is basically the same as that in Example 1, except that steps S1 to S3 are as follows:

[0041] S1. Pre-treatment of the film: use 600# non-woven fabric to brush the surface of the production board, the grinding speed is 3.0m / min, the grinding scar width is 12mm, and then the production board is ultra-roughened and micro-etched with organic acid, and the amount of copper etched is 0.8μm;

[0042] S2. Film application: Use an automatic film laminating machine to apply a dry film to the production board. When the dry film is pasted, the temperature of the production board’s passing reel is 100°C, the speed is 3.0m / min, and the film lamination pressure applied by the film laminating machine is 4kg / cm 2 ;

[0043] S3, exposure, development: adopt full-automatic exposure machine and positive circuit film, finish ...

Embodiment 3

[0046] This embodiment provides a thin-plate manufacturing method, especially a method for solving thin-plate circuit dog teeth with a plate thickness <1.0mm. This method is basically the same as that in Example 1, except that steps S1 to S3 are as follows:

[0047] S1. Pre-treatment of the film: use 600# non-woven cloth to brush the surface of the production board, the grinding speed is 3.4m / min, the width of the grinding scar is 16mm, and then use organic acid to perform ultra-roughening and micro-etching on the production board, and the copper etching amount is 0.8μm;

[0048] S2. Film application: Use an automatic film laminating machine to apply a dry film to the production board. When the dry film is pasted, the temperature of the production board’s passing reel is 130°C, the speed is 3.8m / min, and the film lamination pressure applied by the film laminating machine is 6kg / cm 2 ;

[0049] S3, exposure, development: adopt full-automatic exposure machine and positive circu...

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PUM

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Abstract

The invention discloses a method for solving the problem of an uneven sawtooth-shaped circuit of a thin board. The method comprises the following steps of performing pretreatment before film pasting, carrying out grinding and brushing of the surface of a production board by non-woven fabric at the board grinding speed of 3.0-3.4m / min with width of a grinding mark of 12-16mm, and then performing micro etching on the production board with copper etching amount of 0.8[mu]m, wherein the production board is already subjected to processes of electroless copper plating and all-board electroplating; film pasting: performing film pasting on the production board by adopting an automatic film pasting machine at a board-passing furnace temperature of 100-130 DEG C, at the film pasting pressure of 4-6kg / cm<2> and at the film pasting speed of 3.0-3.8m / min; and exposure and developing: completing exposure of an outer layer circuit by a six-grid exposure rule by adopting a full automatic exposure machine and a positive sheet circuit film, and by performing developing, forming an outer layer circuit pattern on the production board. According to the method, by means of controlling roughening and film pasting parameters of the thin board, the binding force between the circuit board and a dry film can be improved and a condition of tin permeation in tin electroplating can be prevented, so that the problem of the uneven sawtooth-shaped circuit can be solved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for solving thin-plate circuit dog teeth. Background technique [0002] The production process of circuit boards generally includes material cutting → negative film making inner layer circuit → pressing → drilling → copper sinking → full board electroplating → positive film process to make outer layer circuit → making solder mask layer → surface treatment → forming. In the process of making the outer circuit, the problem of line dog teeth is prone to occur. The line dog teeth are partially etched on both sides of the line, resulting in inconsistent overall line width. [0003] The problem of line dog teeth is mainly concentrated in the production of thin plates (thickness<1.0mm). When the thin plate with thickness<1.0mm is pre-treated on the outer layer, if the amount of brushing is too large, it is easy to cause deformation of the board; if the ou...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/052
Inventor 钟宇玲敖四超寻瑞平张华勇
Owner JIANGMEN SUNTAK CIRCUIT TECH