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Epoxy resin adhesive and preparation method thereof

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor adhesive effect and high temperature resistance, and achieve good adhesive effect and improved temperature resistance. , the effect of simple operation

Inactive Publication Date: 2017-08-22
响水格思琪科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: the existing epoxy resin adhesive has poor bonding effect at high temperature and is not resistant to high temperature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0022] The present invention also provides a kind of preparation method of above-mentioned epoxy resin adhesive, comprises the following steps:

[0023] a. After mixing epoxy resin and polyamide curing agent in proportion, add diacetone alcohol, heat to 50-80°C, and cook for 30-45min;

[0024] b. Stir and add aluminum tripolyphosphate and bisphenol A to the mixture obtained in step a, maintain the temperature at 50-80° C., continue stirring for 10-20 min, and cool to room temperature to prepare an epoxy resin adhesive.

[0025] Wherein, in order to make the epoxy resin adhesive more cohesive, in the preparation method of the above epoxy resin adhesive, the stirring described in step b is kept at a constant speed, and the stirring speed is 300-400 r / min.

[0026] Wherein, in order to make the epoxy resin adhesive capable of high temperature resistance, in the preparation method of the above epoxy resin adhesive, in step b, an organosiloxane coupling agent and an initiator are a...

Embodiment 1

[0028] Embodiment 1 Adopt the method of the present invention to prepare epoxy resin adhesive

[0029] The raw materials are as follows: 50 parts of epoxy resin, 20 parts of polyamide curing agent, 10 parts of aluminum tripolyphosphate, 30 parts of bisphenol A, and 150 parts of diacetone alcohol.

[0030] The specific operation steps are:

[0031] a. After mixing epoxy resin and polyamide curing agent in proportion, add diacetone alcohol, heat to 50°C, and cook for 30 minutes;

[0032] b. Stir and add aluminum tripolyphosphate and bisphenol A to the mixture obtained in step a, maintain the temperature at 50° C., continue stirring for 10 min, and cool to room temperature to prepare epoxy resin adhesive 1.

Embodiment 2

[0033] Embodiment 2 Adopt the method of the present invention to prepare epoxy resin adhesive

[0034] The raw materials are as follows: 70 parts of epoxy resin, 10 parts of polyamide curing agent, 5 parts of aluminum tripolyphosphate, 20 parts of bisphenol A, and 100 parts of diacetone alcohol.

[0035] The specific operation steps are:

[0036] a. After mixing epoxy resin and polyamide curing agent in proportion, add diacetone alcohol, heat to 80°C, and cook for 45 minutes;

[0037] b. Stir and add aluminum tripolyphosphate and bisphenol A to the mixture obtained in step a, maintain the temperature at 80° C., continue stirring for 20 minutes, and cool to room temperature to prepare epoxy resin adhesive 2.

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PUM

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Abstract

The invention discloses an epoxy resin adhesive and a preparation method thereof, belonging to the technical field of resin preparation. According to the epoxy resin adhesive and the preparation method, the problems that an existing epoxy resin adhesive has poor adhesion effect at a high temperature, cannot resist high temperature and the like are solved. The epoxy resin adhesive contains the following components in parts by weight: 50-70 parts of epoxy resin, 10-20 parts of a polyamide curing agent, 5-10 parts of aluminum tripolyphosphate, 20-30 parts of bisphenol A and 100-150 parts of diacetone alcohol. The preparation method comprises the steps of uniformly mixing the raw materials, heating, and stirring for a proper time. The adhesive prepared by mixing the epoxy resin, the polyamide curing agent, aluminum tripolyphosphate, bisphenol A and diacetone alcohol in a proportion has stable properties and good adhesion effects at high temperature and can resist the high temperature of above 90 DEG C, and compared with a common epoxy resin adhesive, the tolerance temperature is increased by above 30 DEG C. The preparation method is simple in operation, low in equipment requirement and suitable for being popularized and used.

Description

technical field [0001] The invention belongs to the technical field of resin preparation, and in particular relates to an epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin generally refers to molecules containing two or more epoxy groups, with aliphatic, alicyclic or aromatic organic compounds as the backbone, and can be formed by the reaction of epoxy groups in the presence of a curing agent. A general term for three-dimensional network cured compounds. [0003] Epoxy resin is one of thermosetting polymer materials, which has good chemical stability, adhesion, mechanical properties, insulation, etc., and is widely used in coatings, casting materials, molding materials and other fields. When epoxy resin is used as an adhesive, it usually has good bonding strength and flexibility at low temperature, but the bonding performance is greatly reduced at high temperature, and it cannot be used in fields that require high temperature w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C08G59/44
CPCC08G59/44C08K5/07C08K5/13C08K2003/327C08L2201/08C09J11/04C09J11/06C09J163/00
Inventor 顾桂平
Owner 响水格思琪科技有限公司