A kind of photosensitive resin composition for photocuring 3D printing
A 3D printing, photosensitive resin technology, applied in the direction of additive processing, etc., can solve the problems of long operation time, high decomposition temperature, reduce operation time, etc., and achieve the effect of low ash content and low decomposition temperature
Active Publication Date: 2019-05-24
GUANGDONG HENGDA NEW MATERIALS TECH
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Problems solved by technology
[0005] The currently used photosensitive resin has the disadvantages of high decomposition temperature and long operation time. Lowering the decomposition temperature will help reduce the cracking of the mold shell and reduce the operation time.
Method used
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Embodiment 5
[0029] Urethane acrylate is prepared by the following method in embodiment 5:
[0030] In a three-necked flask equipped with a stirrer, a condenser, and a dropping funnel, add polyethylene glycol 2000 and a certain amount of solvent butyl acetate, and add hexamethylene diisocyanate HDI and hexamethylene diisocyanate successively under stirring, and heat to React at 70-80°C for 2 hours. Using dibutyltin laurate (DBT) as a catalyst, slowly drop it into the reactor and heat it to 75°C for 1 hour. Then lower it to 40°C, add hydroxyethyl acrylate HEA, heat to 70-75°C, until the reaction is complete, it is a polyurethane acrylate oligomer.
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Abstract
The invention belongs to the technical field of chemical materials for photocuring 3D printing, and specifically discloses a photosensitive resin composition for photocuring 3D printing for investment casting. The photosensitive resin composition of the present invention comprises the following components by weight percentage: (A) polyether polyol (meth)acrylate 40-80%, (B) acrylate oligomer 0-40%, (C) alkane 10-50% of oxidized acrylate monomer, (D) 0.1-5% of photoinitiator, (E) 0.01-5% of auxiliary agent, and the sum of the above components reaches 100%. The photosensitive resin composition of the present invention can effectively reduce the gasification and cracking temperature by using a substance containing C-O ether bonds with a low cracking temperature, thereby obtaining a low decomposition temperature, low ash content, and high-precision lost foam.
Description
technical field [0001] The invention belongs to the technical field of chemical materials for photocuring 3D printing, and in particular relates to a photosensitive resin composition for photocuring 3D printing used in investment casting. Background technique [0002] 3D printing is a rapid prototyping technology that has developed rapidly in recent years. It has more than a dozen different technology types. Among them, photocuring technology is the most widely used. It uses photosensitive resin as the molding material, and controls the scanning of ultraviolet light by computer. The resin is cured in a certain shape to form a thin sheet with a certain thickness, and a layer of new liquid photosensitive resin is coated on the basis of the original cured sheet to continue the next scanning and curing. The new layer is cured and bonded to the previous layer, and the process is repeated to obtain a complete part. Compared with other types of 3D printing technology, light-curing...
Claims
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IPC IPC(8): C08F283/06C08F291/12C08F291/06C08F222/20B33Y70/00
CPCC08F283/008C08F283/065B33Y70/00C08F222/104C08F222/102C08F222/103
Inventor 陈天来关怀杨伟胜何金文周为民
Owner GUANGDONG HENGDA NEW MATERIALS TECH