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Gallium nitride position sensitive radiation detector and preparation method thereof

A radiation detector, gallium nitride technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low energy deposition rate, detector structure and parameters can not be used as a reference, small signal, etc., to solve the problem of preparation Effect

Active Publication Date: 2017-08-25
DALIAN UNIV OF TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are no related reports on the preparation of position-sensitive radiation detectors based on gallium nitride materials.
The main reasons are: 1. The high-quality gallium nitride single crystal substrate has only been successfully developed recently; 2. The particles or rays emitted by the radiation source have extremely high penetrating ability, and the energy deposition rate in the semiconductor is low, resulting in The signal is extremely small, and the structure and parameters of traditional semiconductor detectors can no longer be used as a reference. 3. Gallium nitride is a new type of wide bandgap semiconductor. Innovative device structure design

Method used

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  • Gallium nitride position sensitive radiation detector and preparation method thereof

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Embodiment 1

[0028] Step 1: On a semi-insulating GaN single crystal substrate, epitaxially grow an n-type GaN layer with a thickness of 3 μm by metal-organic chemical vapor deposition technology;

[0029] Step 2: On the n-type gallium nitride layer prepared in step 1, an InGaN insertion layer is epitaxially grown by metal-organic chemical vapor deposition technology, with a thickness of 60 nm;

[0030] Step 3: On the InGaN insertion layer prepared in Step 2, epitaxially grow a high-resistance gallium nitride detection sensitive region with a thickness of 20 μm by metal-organic chemical vapor deposition technology;

[0031] Step 4: Epitaxially grow a p-type GaN layer with a thickness of 200 nm on the high-resistance GaN detection sensitive area prepared in Step 3 by metal-organic chemical vapor deposition technology;

[0032] Step 5: Prepare a mask pattern for the p-type gallium nitride layer prepared in step 4 using photolithography technology, and use inductively coupled plasma etching te...

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Abstract

The invention provides a gallium nitride position sensitive radiation detector and a preparation method thereof, and belongs to the technical field of semiconductor device preparation. The detector has a semi-insulating gallium nitride single crystal substrate on which an n-type gallium nitride layer, an InGaN insertion layer, a high-resistance gallium nitride detection sensitive region, patterned p-type gallium nitride layers and an insulating medium protection layer are sequentially grown. The InGaN insertion layer is has a smaller width than the n-type gallium nitride layer, and the InGaN intercalation layer and the high-resistance gallium nitride detection sensitive region have the same width. The plurality of patterned p-type gallium nitride layers are spaced on the high-resistance gallium nitride detection sensitive region, an upper ohmic contact electrode is prepared on the patterned p-type gallium nitride layers, and a lower ohmic contact electrode is prepared on an uncovered region on the n-type gallium nitride layer. Outside the patterned p-type gallium nitride layers is the insulating medium protection layer. The invention solves the problem of preparing a high-performance gallium nitride position sensitive radiation detector and realizes the development of the new type of gallium nitride position sensitive radiation detector.

Description

technical field [0001] The invention belongs to the technical field of semiconductor device preparation, and relates to a radiation detector based on gallium nitride material and a preparation method thereof. Background technique [0002] The third-generation wide-bandgap semiconductor materials represented by gallium oxide are widely used in high-frequency, high-power, It has important applications in electronic devices such as radiation resistance. GaN has a bandgap width of 3.39eV, can exist stably at room temperature and higher, and has excellent chemical stability. In addition, the radiation resistance of GaN is 10,000 times that of Si, and has better radiation resistance. The density of GaN is 6.2g / cm 3 , for the same detection energy range, the GaN detector can be made thinner to improve the sensitivity of the detector. The theoretical intrinsic energy resolution (@60keV) of GaN material can also reach 0.643keV. These excellent properties of GaN make it an ideal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0352H01L31/117H01L31/18
CPCH01L31/035281H01L31/117H01L31/1848
Inventor 夏晓川崔兴柱梁红伟梁晓华刘雅清
Owner DALIAN UNIV OF TECH