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High-tenacity epoxy resin adhesive

A technology of epoxy resin glue and high toughness, applied in epoxy resin glue, novolac epoxy resin adhesive, adhesive and other directions, can solve the problems of poor spreadability, high brittleness of cured product, poor toughness, etc. The effect of reducing dosage, good bonding performance and obvious toughening effect

Inactive Publication Date: 2017-09-08
芜湖瀚邦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy adhesives have excellent adhesion, wear resistance, mechanical properties, electrical insulation properties, chemical stability, and durability. With the development of the electronics industry towards miniaturization, light weight, and precision, epoxy adhesives are used in The device manufacturing industry has been widely used and has become an important insulating material in the electronics industry; but at present, epoxy adhesives are limited in some precision and cutting-edge fields due to their shortcomings of high brittleness, poor toughness, and poor smearability. Applications

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A kind of high-toughness epoxy resin adhesive that the present invention proposes, its raw material comprises A component and B component by weight;

[0020] The raw materials of component A include by weight: 25 parts of bisphenol S-type epoxy resin, 15 parts of novolak epoxy resin, 10 parts of β-cyclodextrin complex, 2 parts of tricresyl phosphate, 2 parts of vermiculite powder, 4 parts of nano calcined kaolin, 2 parts of expanded perlite powder, 1.5 parts of methyltriethoxysilane, 30 parts of trimethylolpropane-oxypropylene polyether triol, 2 parts of anti-aging agent, 1 part of dispersant;

[0021] The raw materials of component B include by weight: 4 parts of phenolic modified amine curing agent, 2 parts of boron trifluoride complex, 40 parts of trimethylolpropane-oxypropylene polyether triol;

[0022] The weight ratio of component A and component B is 100:2.

Embodiment 2

[0024] A kind of high-toughness epoxy resin adhesive that the present invention proposes, its raw material comprises A component and B component by weight;

[0025] The raw materials of component A include by weight: 35 parts of bisphenol S-type epoxy resin, 5 parts of novolac epoxy resin, 16 parts of β-cyclodextrin complex, 1 part of tricresyl phosphate, 4 parts of vermiculite powder, 2 parts of nano-calcined kaolin, 4 parts of expanded perlite powder, 0.5 part of methyltriethoxysilane, 50 parts of trimethylolpropane-propylene oxide polyether triol, 1 part of anti-aging agent, and 2 parts of dispersant;

[0026] The raw materials of component B include by weight: 1 part of phenolic modified amine curing agent, 6 parts of boron trifluoride complex, and 30 parts of trimethylolpropane-oxypropylene polyether triol;

[0027] The weight ratio of component A and component B is 100:6.

[0028] The β-cyclodextrin complex is prepared by the following process: Stir the β-cyclodextrin, ...

Embodiment 3

[0030] A kind of high-toughness epoxy resin adhesive that the present invention proposes, its raw material comprises A component and B component by weight;

[0031] The raw materials of component A include by weight: 28 parts of bisphenol S-type epoxy resin, 12 parts of novolak epoxy resin, 14 parts of β-cyclodextrin complex, 1.6 parts of tricresyl phosphate, 2.5 parts of 1000 mesh vermiculite powder 3.5 parts of nano calcined kaolin, 2.5 parts of 2000 mesh expanded perlite powder, 1.2 parts of methyl triethoxysilane, 35 parts of trimethylolpropane-oxypropylene polyether triol, 1.8 parts of anti-aging agent, 1.6 parts of dispersant share;

[0032] The raw materials of component B include by weight: 3 parts of phenolic modified amine curing agent, 3 parts of boron trifluoride complex, 38 parts of trimethylolpropane-oxypropylene polyether triol;

[0033] The weight ratio of component A and component B is 100:3.

[0034] The β-cyclodextrin complex is prepared by the following p...

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Abstract

The invention discloses a high-tenacity epoxy resin adhesive. The high-tenacity epoxy resin adhesive comprises the raw materials of a component A and a component B, wherein the component A comprises the following raw materials in parts by weight: 25-35 parts of bisphenol S epoxy resin, 5-15 parts of linear phenolic epoxy resin, 10-16 parts of a beta-cyclodextrin compound, 1-2 parts of tricresyl phosphate, 2-4 parts of vermiculite powder, 2-4 parts of nano-calcined kaolin, 2-4 parts of expanded perlite powder, 0.5-1.5 parts of methyl triethoxysilane, 30-50 parts of trimethylolpropane-propylene oxide polyether triols, 1-2 parts of an antiager and 1-2 parts of a dispersant; the component B comprises the folloiwng raw materials in parts by weight: 1-4 parts of a phenolic modified amine curing agent, 2-6 parts of a boron trifluoride complex and 30-40 parts of trimethylolpropane-propylene oxide polyether triols; and the weight ratio of the component A to the component B is 100:(2-6).

Description

technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to a high-toughness epoxy resin adhesive. Background technique [0002] Epoxy adhesives have excellent adhesion, wear resistance, mechanical properties, electrical insulation properties, chemical stability, and durability. With the development of the electronics industry towards miniaturization, light weight, and precision, epoxy adhesives are used in The device manufacturing industry has been widely used and has become an important insulating material in the electronics industry; but at present, epoxy adhesives are limited in some precision and cutting-edge fields due to their brittleness, poor toughness, and poor smearability. Applications. Contents of the invention [0003] Based on the technical problems existing in the background technology, the present invention proposes a high-toughness epoxy resin adhesive, which has good curing performance and mechanical st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/02C09J163/00C09J163/04C09J11/04C09J11/06C09J11/08
CPCC08K2201/011C08L2205/02C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C09J171/02C08L63/00C08L63/04C08L5/16C08K13/04C08K3/34C08K3/346C08K7/26C08K5/5419
Inventor 刘发旺
Owner 芜湖瀚邦新材料科技有限公司
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