Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A heating carrier, its control method, and thin film packaging equipment

A control method and a carrier technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of reduced lifespan of organic materials, insufficient edge density of packaging films, and reduced reliability and yield of OLED devices. Achieve the effect of increasing the density, improving the insufficient density of the edge of the packaging film, reducing the life of the organic material, and reducing the temperature

Active Publication Date: 2019-11-05
BOE TECH GRP CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a heating carrier and its control method, and thin film packaging equipment, which are used to solve the problem of insufficient edge density of the packaging film of the OLED device and the decrease in the life of the organic material caused by the heating carrier in the prior art, which in turn leads to the failure of the OLED device. Problems of Reliability and Yield Decrease

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A heating carrier, its control method, and thin film packaging equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] see figure 1 As shown, the present embodiment provides a heating carrier, comprising:

[0032] The carrying platform body 100, in specific implementation, the carrying platform body 100 is provided with a carrying surface for carrying the substrate;

[0033] The first heating device 200, the first heating device 200 forms a first heating area 101 on the carrier body 100, in specific implementation, the first heating area 101 is set on the carrier surface;

[0034] The second heating device 300, the second heating device 300 forms a second heating area 102 on the carrier body 100, the second heating area 102 is arranged around the first heating area 101, in specific implementation, the second heating area 102 is arranged on the carrier surface superior;

[0035] A temperature control device 400, the temperature control device 400 is respectively connected to the first heating device 200 and the second heating device 300, and is used to control the temperature of the fi...

Embodiment 2

[0044] This embodiment provides a method for controlling the heating carrier as provided in Embodiment 1 above, and the control method specifically includes:

[0045] The temperature control device 400 controls the temperature of the second heating device 300 to be higher than the temperature of the first heating device 200 during the heating process, and controls the temperature of the first heating device 200 to gradually decrease during the heating process.

[0046] During the use of current OLED devices, water and oxygen usually infiltrate from the edge of the encapsulation film, resulting in a decrease in the service life of the OLED device. Therefore, increasing the density of the edge of the encapsulation film can reduce the probability of water and oxygen infiltration. During the deposition process of the packaging film, the temperature of the substrate has an important influence on the properties and structural stability of the packaging film. Increasing the temperatur...

Embodiment 3

[0053] Based on the same inventive concept, the present invention also provides a thin film encapsulation device, including the heating platform provided in the first embodiment above. In a specific implementation, the thin film packaging equipment further includes a plasma gas generating device.

[0054] The thin film encapsulation equipment provided in this embodiment also solves the problems in the prior art that the edge density of the encapsulation film of the OLED device is insufficient and the lifespan of the organic material is shortened by the heated stage, which further leads to a decrease in the reliability and yield of the OLED device. For its principle and specific implementation, refer to Embodiment 1 above, and details are not repeated here.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In the field of design and display technology, the present invention discloses a heating platform and its control method, and film packaging equipment. The heating platform includes: a platform body; a first heating device, which forms a first heating area on the platform body ; The second heating device, the second heating device forms a second heating area on the carrier body, the second heating area is arranged around the first heating area; the temperature control device, the temperature control device is respectively connected with the first heating device and the second heating device connected, and used to control the temperature of the first heating device and the second heating device, so that the temperature of the second heating device during the heating process is higher than the temperature of the first heating device during the heating process, and the temperature of the first heating device gradually decreases during heating. The invention can improve the problem that the edge density of the encapsulation film of the OLED device is insufficient and the service life of the organic material is shortened caused by the heating stage in the prior art, which further leads to a decrease in the reliability and yield of the OLED device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a heating carrier, a control method thereof, and a thin film packaging device. Background technique [0002] OLED (Organic Light-Emitting Diode; organic electroluminescent) devices have the characteristics of low power consumption, light weight, high brightness, wide field of view, high contrast and fast response, and have been widely used in the consumer electronics market. In order to improve the service life of OLED devices, OLED devices need to be packaged by encapsulation technology in the production process of OLED devices, so as to reduce the erosion caused by water and oxygen penetration during use. Thin film encapsulation is a commonly used encapsulation method at present. By setting one or more layers of thin films formed of organic materials or inorganic materials on the OLED device, it can isolate the OLED device from the external environment and slow down the penetr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683H01L51/52
CPCH01L21/67103H01L21/683H10K50/84
Inventor 全威
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com