Etchant composition for copper/molybdenum film or copper/molybdenum alloy film

A technology of composition and molybdenum alloy, which is applied in the field of etching liquid composition, can solve the problems of low metal content, large amount of etching liquid, loss of etching cone angle, etching deviation and etching straightness, etc., so as to increase the etching capacity , increase the number of repetitions, reduce the effect of dosage

Active Publication Date: 2017-10-03
ENF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, for the etchant using hydrogen peroxide as the substrate, in order to repeatedly etch, the content of metal ions in the etchant increases. This metal ion can play a catalytic role in decomposing hydrogen peroxide, resulting in etching cone angle, etching deviation and etching. Straightness and other characteristics are lost, resulting in low metal content to maintain etching characteristics, and the problem of using a large amount of etching solution.

Method used

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  • Etchant composition for copper/molybdenum film or copper/molybdenum alloy film
  • Etchant composition for copper/molybdenum film or copper/molybdenum alloy film
  • Etchant composition for copper/molybdenum film or copper/molybdenum alloy film

Examples

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Embodiment approach

[0020] According to another embodiment of the present invention, in addition to the etching inhibitor, the etchant composition further includes a glass etching inhibitor, which can slow down the etching speed of the glass substrate as the lower film to the greatest extent. Preferably, the glass etching inhibitor is a compound containing both boron atoms and fluorine atoms; more preferably, the glass etching inhibitor is boric acid or boric acid salt, and is further preferably selected from the group consisting of fluoroboric acid (HBF 4 ), sodium fluoroborate (NaBF 4 ), potassium fluoroborate (KBF 4 ), ammonium fluoroborate (NH 4 BF 4 ) and mixtures thereof.

[0021] Preferably, the glass etch inhibitor is present in an amount of 0.01 to 2% by weight, more preferably in an amount of 0.05 to 1% by weight. If it is less than 0.01% by weight, the effect of inhibiting glass etching is very small, and if it exceeds 2% by weight, the etching speed will be slowed down and the eng...

Embodiment 1 to 10 and comparative example 1

[0037] The contents of the components listed in Table 1 below were mixed to prepare the compositions of Examples 1 to 10 and Comparative Example 1 of the present invention.

[0038] Table 1

[0039]

[0040] ATZ: 5-aminotetrazole (5-aminotetrazole),

[0041] IDA: iminodiacetic acid (iminodiacetic acid),

[0042] PHS: Potassium hydrogen sulfate

[0043] MEA: monomethanolamine

[0044] NMEA: N-methylethanolamine (N-methylethanolamine)

[0045] EA: Ethanolamine

[0046] DEA: Diethanolamine

[0047] TEA: Triethanolamine

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Abstract

The present invention relates to an etchant composition for a copper / molybdenum film or a copper / molybdenum alloy film. The etchant composition for a copper / molybdenum or a copper / molybdenum alloy film according to this invention contains an etching stabilizer which is a compound having an alcohol group and an amine group. The etchant composition according to the present invention can not only maintain etching characters such as etching taper angle, etching bias and etching linearity even when the content of the metal ions in the etchant is higher due to the repetition of the etching process but also be used in the production of the elcrtrodes for TFT-LCD displays and OLED.

Description

[0001] This application is a divisional application based on application number 201410012683.2. The filing date of the original application is: 2014.01.10; the invention name of the original application is: etching solution composition for copper / molybdenum film or copper / molybdenum alloy film technical field [0002] The invention relates to an etching liquid composition of a copper / molybdenum film or a copper / molybdenum alloy film, especially an etching liquid composition for a copper / molybdenum film or a copper / molybdenum alloy film of display electrodes such as TFT-LCD and OLED. Background technique [0003] Microcircuits such as semiconductor devices, TFT-LCDs, and OLEDs are coated evenly on conductive metal films such as aluminum, aluminum alloys, copper, and copper alloys or insulating films such as silicon dioxide films and silicon nitride films formed on substrates. The photoresist is then imaged after light irradiation through the patterned film to make the required...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/44
CPCC23F1/44C23F1/18
Inventor 金世训李恩庆李宝妍申孝燮
Owner ENF TECH
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