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Tin plating solution and efficient tin plating technology based on tin plating solution

A tin plating solution and tin plating technology, applied in the field of tin plating on bare copper, can solve the problems of uneven plating, cracking of tin layer, etc., and achieve the effects of high plating efficiency, easy operation, and simple formula

Inactive Publication Date: 2017-10-17
江苏金坤科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention also discloses the preparation method of the above electroplating solution and the tin plating process using the modified electroplating solution, but the tin layer contains organic foreign matter, which is prone to cracking of the tin layer and uneven electroplating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A tin-plating solution, comprising the following raw materials in parts by mass: methanesulfonic acid: 23 parts, tin methanesulfonate: 24 parts, matte tin additive: 1 part, pure water: 44 parts; wherein the raw material of matte tin additive The ingredients include 2 parts of stannous sulfate and 15 parts of sulfuric acid.

[0032] In this embodiment, the pure water is produced by a professional pure water machine, and the conductivity is less than 50 μS / cm.

[0033] A kind of high-efficiency tin-plating process based on above-mentioned tin-plating liquid, comprises the following steps:

[0034] S1: Ultrasonic dust removal, place the bare copper wire in water containing detergent for 50 seconds to remove surface dust, and then rinse with tap water;

[0035] S2: pickling, put the bare copper wire in S1 in the pickling solution to completely remove the oxides and dirt on its surface, and then rinse it again with pure water, the pickling solution is 14% dilute sulfuric ac...

Embodiment 2

[0043] A tin-plating solution, comprising the following raw materials in parts by mass: methanesulfonic acid: 27 parts, tin methanesulfonate: 29 parts, matte tin additive: 3 parts, pure water: 48 parts; wherein the raw material of matte tin additive The ingredients include 3.5 parts of stannous sulfate and 20 parts of sulfuric acid.

[0044] In this embodiment, the pure water is produced by a professional pure water machine, and the conductivity is less than 50 μS / cm.

[0045] A kind of high-efficiency tin-plating process based on above-mentioned tin-plating liquid, comprises the following steps:

[0046] S1: Ultrasonic dust removal, place the bare copper wire in water containing detergent for 70 seconds to remove surface dust, and then rinse with tap water;

[0047] S2: pickling, put the bare copper wire in S1 in the pickling solution to completely remove the oxides and dirt on its surface, and then rinse it again with pure water, the pickling solution is 17% dilute sulfuric...

Embodiment 3

[0055] A tin-plating solution, comprising the following raw materials in parts by mass: methanesulfonic acid: 25 parts, tin methanesulfonate: 27 parts, matte tin additive: 2 parts, pure water: 46 parts; wherein the raw material of matte tin additive The ingredients include 3 parts of stannous sulfate and 17 parts of sulfuric acid.

[0056] In this embodiment, the pure water is produced by a professional pure water machine, and the conductivity is less than 50 μS / cm.

[0057] A kind of high-efficiency tin-plating process based on above-mentioned tin-plating liquid, comprises the following steps:

[0058] S1: Ultrasonic dust removal, place the bare copper wire in water containing detergent for 60 seconds to remove surface dust, and then rinse with tap water;

[0059] S2: pickling, put the bare copper wire in S1 in the pickling solution to completely remove the oxides and dirt on its surface, and then rinse it again with pure water, the pickling solution is 15% dilute sulfuric aci...

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Abstract

The invention provides a tin plating solution and an efficient tin plating process based on the tin plating solution. The tin plating solution includes the following raw materials in parts by mass: 23-27 parts of methanesulfonic acid, 24-29 parts of tin methanesulfonate, Matte tin additive 1-3 parts, pure water 44-48 parts, the raw material composition of described matte tin additive comprises stannous sulfate and sulfuric acid, the efficient tin plating process based on this tin plating solution comprises steps: ultrasonic dust removal, pickling, micro etched, tinned, sealed and dried. The invention can thoroughly clean the bare copper, has high tinning efficiency, and the formed tin layer has uniform thickness, no cracking, and is not easy to oxidize.

Description

technical field [0001] The invention relates to the technical field of bare copper tin plating in FFC production, in particular to a tin plating solution and an efficient tin plating process based on the tin plating solution. Background technique [0002] Tin has the advantages of corrosion resistance, discoloration resistance, non-toxicity, easy brazing, softness, low melting point and good ductility. Industries such as components and semiconductor packaging, and are usually formed by electroplating. Electroplating is the process of plating a layer of other metals or alloys on the surface of some metals by using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material substrates. FFC (Flexible Flat Cable, flexible flat cable) can be used as a data transmission cable and has a wide range of applications. The wire base material in the FFC structure is bare copper. In order to improve the c...

Claims

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Application Information

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IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 张志敏陈栋
Owner 江苏金坤科技有限公司
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