Automatic board grinding system for circuit board resistance welding and board grinding method

A circuit board and grinding board technology, which is applied in the direction of automatic grinding control devices, machine tools suitable for grinding workpiece planes, and machine tools suitable for grinding workpiece edges, etc., which can solve the problems of low automation, waste of resources, and low grinding efficiency and other problems, to achieve the effect of high degree of automation, easy operation, and simple grinding method

Pending Publication Date: 2017-10-20
信丰迅捷兴电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the existing conditions, the grinding device of the circuit board has a low degree of automation, a large amount of labor is required, the grinding efficiency is low, and the operation cannot be monitored manually; in addition, a lot of metal powder is produced during the grinding process, which cannot be recycled, pollutes the environment, and causes resources The waste of the powder attached to the circuit board also affects the surface flatness of the grinding board

Method used

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  • Automatic board grinding system for circuit board resistance welding and board grinding method
  • Automatic board grinding system for circuit board resistance welding and board grinding method
  • Automatic board grinding system for circuit board resistance welding and board grinding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Reference Figure 1 to Figure 3 , An automatic plate grinding system for circuit board solder resist, comprising a conveying frame 1, a conveying mechanism set on the top of the conveying frame 1, a grinding mechanism 3, a grasping mechanism 4, a recycling mechanism 5 and a control mechanism for controlling the operation of the system 6. The conveying mechanism 2 includes a first conveying component 201, a second conveying component 202, and a third conveying component 203. A waiting sensor 204 is installed at the exit of the first conveying component 201, and in the middle of the second conveying component 202 A grasping positioning sensor 205 is installed at the position, and a board ejection sensor 206 is installed at the entrance of the third conveying assembly 203;

[0041] A fixed bracket is arranged on the conveying frame 1 at the position of the second conveying assembly 202, the polishing mechanism 3 and the recovery mechanism 5 are arranged on the side wall of the...

Embodiment 2

[0043] Refer to Figure 1 to Figure 5 , An automatic plate grinding system for circuit board solder resist, comprising a conveying frame 1, a conveying mechanism set on the top of the conveying frame 1, a grinding mechanism 3, a grasping mechanism 4, a recycling mechanism 5 and a control mechanism for controlling the operation of the system 6. The conveying mechanism 2 includes a first conveying component 201, a second conveying component 202, and a third conveying component 203. A waiting sensor 204 is installed at the exit of the first conveying component 201, and in the middle of the second conveying component 202 A grasping positioning sensor 205 is installed at the position, and a board ejection sensor 206 is installed at the entrance of the third conveying assembly 203;

[0044] A fixed bracket is arranged on the conveying frame 1 at the position of the second conveying assembly 202, the polishing mechanism 3 and the recovery mechanism 5 are arranged on the side wall of the...

Embodiment 3

[0058] This embodiment adds a fill light and a light sensor on the basis of the second embodiment.

[0059] The supplementary light is arranged on the inner wall of the fixed bracket, and the supplementary light and the light sensor are both connected with the main control single-chip circuit.

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PUM

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Abstract

The invention discloses an automatic board grinding system for circuit board resistance welding. The automatic board grinding system comprises a conveying rack, a conveying mechanism, a polishing mechanism, a grabbing mechanism, a recycling mechanism and a control mechanism, wherein the conveying mechanism, the polishing mechanism, the grabbing mechanism and the recycling mechanism are arranged at the top of the conveying rack; and the control mechanism controls the system to work. The conveying mechanism is divided into three sections, and each section of the conveying mechanism is provided with a sensor. The polishing mechanism and the recycling mechanism are arranged on the side wall of a fixed support. The grabbing mechanism is movably arranged on the top edge of the fixed support. A grabbing camera is installed on the inner wall of the fixed support. A polishing camera is installed at the end of the grabbing mechanism. All the sensors and the cameras are in circuit connection with the control mechanism. The invention discloses an automatic board grinding method for circuit board resistance welding. The automatic board grinding system for circuit board resistance welding is reasonable in structural arrangement, the efficiency of a board grinding production line is improved, and the board grinding effect for meeting different precision requirements is achieved; due to arrangement of the recycling mechanism, the recycling function on abrasive materials is achieved, and cleanliness and environmental protection are realized; and operation is easy and the degree of automation is high.

Description

Technical field [0001] The invention relates to circuit board electrical processing equipment, in particular to an automatic plate grinding system and plate grinding method for circuit board solder resistance, and belongs to the technical field of circuit board processing. Background technique [0002] First, explain the relevant solder mask process in the field of printed circuit board processing: [0003] Solder mask: Provide a permanent protective film with solder resist, insulation, physical and chemical protection for the circuit board. This protective film can also be used as a carrier for text ink printing and give the circuit board a beautiful appearance. [0004] The outer surface of the circuit board is mainly distributed with many "pads" that need to be mounted components, thin lines "lines" for conducting circuits, "copper-free areas" for insulating functions, and "vias" for connecting interlayer circuits. . The main function of solder mask is to protect the parts of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/033B24B9/02B24B7/10B24B27/00B24B41/00B24B51/00B24B49/12
CPCB24B7/10B24B9/02B24B27/0069B24B27/0076B24B27/033B24B41/005B24B49/12B24B51/00
Inventor 杜林峰杨云章周爱明
Owner 信丰迅捷兴电路科技有限公司
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