Phenolic foam heat insulation board and production method thereof

A phenolic foam and thermal insulation board technology is applied in the field of thermal insulation materials, which can solve the problems of poor toughness and high acidity of thermal insulation boards, and achieve the effects of good dispersion, improved thermal stability and flame retardant performance.

Inactive Publication Date: 2017-10-20
合肥广能新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The insulation board still has the prob

Method used

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  • Phenolic foam heat insulation board and production method thereof

Examples

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Example Embodiment

[0023] Example 1

[0024] A phenolic foam insulation board, calculated in parts by weight, including the following raw materials:

[0025] 75 parts of phenolic resin, 7 parts of modified nano-silica, 6 parts of toughening agent, 5 parts of Tween 80, 12 parts of phosphoric acid and 6 parts of cyclopentane.

[0026] The modified nano-silica is prepared by the following method: dissolve the nano-silica in ethyl acetate, heat to 50℃ in a water bath, adjust the pH to 8.5 with ammonia water, add KH560 for reaction, the reaction time is 20h, and then centrifuge Washing to obtain modified nano silica. The molar ratio of KH560 to nano silica is 5:1.

[0027] The toughening agent is a mixture of polyethylene glycol and acrylic styrene copolymer emulsion, wherein the mass percentage of acrylic styrene copolymer emulsion is 30%, and the percentage of polyethylene glycol is 70%.

[0028] Preparation:

[0029] 1) Preparation of modified nano-silica: dissolve nano-silica in ethyl acetate, heat to 50℃...

Example Embodiment

[0032] Example 2

[0033] A phenolic foam insulation board, calculated in parts by weight, including the following raw materials:

[0034] 70 parts of phenolic resin, 5 parts of modified nano silica, 4 parts of toughening agent, 806 parts of Tween, 10 parts of p-toluenesulfonic acid and 4 parts of n-pentane.

[0035] The modified nano-silica is prepared by the following method: dissolve the nano-silica in ethyl acetate, heat it to 40℃ in a water bath, adjust the pH to 8 with ammonia water, add KH550 for reaction, the reaction time is 18h, and then centrifuge Washing to obtain modified nano silica. The molar ratio of KH550 to nano silica is 6:1.

[0036] The toughening agent is a mixture of polyethylene glycol and acrylic styrene copolymer emulsion, wherein the mass percentage of acrylic styrene copolymer emulsion is 40%, and the percentage of polyethylene glycol is 60%.

[0037] Preparation:

[0038] 1) Preparation of modified nano-silica: dissolve nano-silica in ethyl acetate, heat to...

Example Embodiment

[0041] Example 3

[0042] A phenolic foam insulation board, calculated in parts by weight, including the following raw materials:

[0043] 80 parts of phenolic resin, 10 parts of modified nano-silica, 8 parts of toughening agent, 803 parts of Tween, 15 parts of hydrochloric acid, and 8 parts of n-pentane.

[0044] The modified nano-silica is prepared by the following method: dissolve the nano-silica in ethyl acetate, heat to 60℃ in a water bath, adjust the pH to 9 with ammonia water, add KH560 for reaction, the reaction time is 24h, and then centrifuge Washing to obtain modified nano silica. The molar ratio of KH560 to nano silica is 4:1.

[0045] The toughening agent is a mixture of polyethylene glycol and acrylic styrene copolymer emulsion, wherein the mass percentage of acrylic styrene copolymer emulsion is 35%, and the percentage of polyethylene glycol is 65%.

[0046] Preparation:

[0047] 1) Preparation of modified nano-silica: dissolve nano-silica in ethyl acetate, heat to 60℃ i...

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Abstract

The invention provides a phenolic foam heat insulation board and a production method thereof. The heat insulation board comprises 70-80 parts of phenolic resin, 5-10 parts of modified nano-silica, 4-8 parts of a toughening agent, 3-6 parts of a surfactant, 10-15 parts of a curing agent and 4-8 parts of a foaming agent. The production method comprises the following steps: 1, preparing the modified nano-silica: dissolving nano-silica in ethyl acetate, carrying out water bath heating to 40-60 DEG C, adjusting the obtained solution to 8-9 by using ammonia water, adding a silane coupling agent, carrying out a reaction for 18-24 h, and carrying out centrifuging and washing to obtain the modified nano-silica; 2, uniformly mixing the phenolic resin, the modified nano-silica, the curing agent and the toughening agent at 50-60 DEG C to obtain a mixture A; and 3, mixing and uniformly stirring the mixture A, the surfactant and the foaming agent, rapidly pouring the obtained mixture into a preheated die, foaming the mixture, and curing the mixture to obtain the heat insulation board. The heat insulation board has the advantages of high strength, high oxygen index, good toughness and low heat conduction coefficient.

Description

technical field [0001] The invention belongs to the technical field of thermal insulation materials, and in particular relates to a phenolic foam thermal insulation board and a preparation method thereof. Background technique [0002] Phenolic insulation board and polyurethane rigid foam are both organic thermosetting high-efficiency insulation materials. Especially in recent years, with the gradual improvement of building energy saving rate, the technical performance of applied insulation materials is getting higher and higher, and the market demand is increasing. In the application of thermal insulation materials in building applications, not only high physical and technical performance is required, but also fire protection performance must be achieved. Although the foam produced by phenolic resin and rigid polyurethane foam are relatively good thermal insulation materials, the two types of thermal insulation materials have different advantages and disadvantages, and do no...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08L71/02C08L33/02C08K9/06C08K3/36C08J9/14
CPCC08L61/06C08J9/141C08J2203/14C08J2361/06C08J2471/02C08K2201/011C08L2201/02C08L2201/08C08L2203/14C08L2205/03C08L71/02C08L33/02C08K9/06C08K3/36
Inventor 刘涛
Owner 合肥广能新材料科技有限公司
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