High-precision selective laser sintering method and device for ultraviolet point light source

A technology of selective laser sintering and point light source, which is applied in the field of additive manufacturing, can solve the problems of high manufacturing precision, large heat-affected area, and low absorption efficiency, etc. good quality effect

Inactive Publication Date: 2017-10-24
XI AN JIAOTONG UNIV
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Problems solved by technology

[0003] In the selective sintering process of polymers as processing materials, carbon dioxide lasers are mainly used at present. This type of laser has high efficiency and a large power range, but the spot diameter is large, the heat-affected area is large, and the forming line width is wider than the design size. High manufacturing precision cannot be achieved
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  • High-precision selective laser sintering method and device for ultraviolet point light source

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Embodiment Construction

[0023] The content of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] see figure 1 , a high-precision selective laser sintering device for ultraviolet point light sources, including a preheating system and a powder spreading device connected to a computer 1, and the computer 1 is connected to an ultraviolet laser 8 and a scanning galvanometer 7.

[0025] The computer 1 and its control software are responsible for controlling the opening and closing of the ultraviolet laser 8, are responsible for converting the information of the layered model into relevant signals to control the motion track of the scanning galvanometer 7, and are responsible for opening the preheating system On and off, responsible for controlling the placement of powder during the 3D printing process.

[0026] The ultraviolet laser 8 emits laser light with a wavelength of 150nm to 500nm, and scans the powder layer of the molding c...

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Abstract

Provided are a high-precision selective laser sintering method and device for an ultraviolet point light source. An ultraviolet laser is adopted, a printing model is generated through a computer, and signals are output through control software, thus movement of a scanning galvanometer is controlled, the point light source is formed by laser in a forming cylinder, and powder sintering forming is carried out. The device comprises a preheating system and a powder laying device, the preheating system and the powder laying device are connected with the computer, and the computer is connected with the ultraviolet laser and the scanning galvanometer. The method and device have the advantages that the light spot diameter is small, the heat affected area is small, single photon energy is large, the processing precision is high, the forming quality is good, the processing material range is wide, and the like.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to a high-precision selective-area laser sintering method and device for an ultraviolet point light source. Background technique [0002] Selected laser sintering (SLS) is an additive manufacturing technology that has developed rapidly in recent years. It is mainly used in many fields such as machinery, aerospace, and bioengineering, involving various powder materials such as metals, ceramics, and polymers. The existing selective laser sintering technology converges the laser beam into a high-energy spot on the processing plane, and controls the spot through software to scan point by point or line by line according to a certain path. Lasers commonly used in SLS technology mainly include carbon dioxide lasers and fiber lasers. [0003] In the selective sintering process of polymers as processing materials, carbon dioxide lasers are mainly used at present. This type of...

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Application Information

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IPC IPC(8): B29C64/153B29C64/268B33Y10/00B33Y30/00
CPCB33Y10/00B33Y30/00
Inventor 贺健康王丰平李涤尘同志强孟子捷蔡智豪仝站国曹毅
Owner XI AN JIAOTONG UNIV
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