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Peeling method of graphene nanoplatelets and application

A technology of graphene microflakes and acrylonitrile, which is applied in the field of exfoliation of graphene microflakes, can solve problems such as poor dispersion effect of graphene microflakes, achieve the effect of increasing the degree of exfoliation, improving the dispersion effect, and improving product performance

Active Publication Date: 2017-11-03
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the traditional melt mixing method is used to exfoliate the graphene microflakes, and the dispersion effect of the graphene microflakes in the polymer is not good.

Method used

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  • Peeling method of graphene nanoplatelets and application
  • Peeling method of graphene nanoplatelets and application
  • Peeling method of graphene nanoplatelets and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] (1) Evenly drop 7.4g of A151 silane coupling agent into 240g of graphene microflakes, stir evenly, and then mix it with 1760g of polypropylene (PP) in a high-speed mixer at 70°C for 5min to obtain a reaction mixture;

[0052] (2) The reaction mixture obtained in step (1) is accurately fed into a twin-screw extruder with a screw diameter of 35 mm, a length-to-diameter ratio of 40:1, and 16 kneading blocks and 5 toothed discs with a feeding device. Melt blending with high shear and high residence time (shear stress is 0.16MPa~0.2MPa, residence time is 400s~600s), the screw speed is 200rpm, the temperature in each zone is between 160°C and 210°C, and finally the After shearing, extrude with a biaxial tensile force field to complete the peeling of the graphene microflakes; the obtained sheet is the graphene microflake / PP composite material.

[0053] The scanning electron microscope figure of the graphene microchip / PP composite material that embodiment 1 provides is as im...

Embodiment 2

[0062] (1) 5.6g of the silane coupling agent of KH560 is evenly dropped into 180g of graphene microchips, stirred evenly, and then mixed with 1820g of acrylonitrile-butadiene-styrene copolymer (ABS) in a high-speed mixer Mix at 80°C for 10 minutes to obtain a reaction mixture;

[0063] (2) The reaction mixture obtained in step (1) is accurately fed into a twin-screw extruder with a screw diameter of 35mm, a length-to-diameter ratio of 40:1, 15 kneading blocks and 6 toothed discs with a feeding device. Melt blending with high shear and high residence time (shear stress is 0.16MPa~0.2MPa, residence time is 400s~600s), the screw speed is 100rpm, the temperature in each zone is between 170°C and 220°C, and finally the After shearing, extrude with a biaxial tensile force field to complete the peeling of the graphene micro-sheets; the obtained sheet is the graphene micro-sheet / ABS composite material.

[0064] Adopt the test method that embodiment 1 provides to test the Graphene mic...

Embodiment 3

[0066] (1) Evenly drop 6.2g titanate coupling agent into 200g graphene microchips, stir evenly, then mix it with 1800g polypropylene (PP) in a high-speed mixer at 70°C for 10min to obtain a reaction mixture;

[0067] (2) The reaction mixture obtained in step (1) is accurately fed into a twin-screw extruder with a screw diameter of 35mm, a length-to-diameter ratio of 40:1, and 13 kneading blocks and 5 toothed discs with a feeding device. Melt blending with high shear and high residence time (shear stress is 0.14MPa~0.16MPa, residence time is 250s~450s), screw speed is 300rpm, temperature in each zone is between 150°C and 200°C. After shearing, extrude with a biaxial tensile force field to complete the peeling of the graphene microflakes; the obtained sheet is the graphene microflake / PP composite material.

[0068] Adopt the test method that embodiment 1 provides to test the Graphene microflake / PP composite material that embodiment 3 obtains, the result shows, the conductivity o...

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Abstract

The invention provides a peeling method of graphene nanoplatelets. The method comprises the following steps: (a) mixing polymers, graphene nanoplatelets and coupling agents to obtain a reaction mixture; and (b) melting and mixing the reaction mixture obtained in the step (a), then extruding to obtain the peeled graphene nanoplatelets, wherein the shearing stress of melting and mixing is 0.14-0.2MPa, and the staying time lasts for 250-600 seconds; the extruding process is carried out in a force field which is firstly sheared and subsequently stretched in two ways. Compared with the prior art, the technical problem of unsatisfactory dispersion effect of a melting and mixing method for compounding the graphene nanoplatelets in the polymers can be solved; the specific melting and mixing condition is matched with a specific extrusion field; the peeling degree of the graphene nanoplatelets is obviously improved, so that the dispersion effect of the graphene nanoplatelets in the polymers is improved on the basis that the excellent properties of the graphene nanoplatelets are not reduced. The peeling method can be used for preparing graphene nanoplatelet / polymer composites and plays an important role in improvement of the properties of the products.

Description

technical field [0001] The invention relates to the technical field of graphene microchip processing, and more specifically, relates to a stripping method and application of graphene microchips. Background technique [0002] As a member of the newly discovered carbon-based materials, graphene microsheets combine the advantages of other carbon-based fillers, with low conductive percolation threshold, excellent electrical conductivity, thermal conductivity and mechanical properties, and the cost is lower than that of single-layer graphene , providing a new direction for the modification of polymers. Adding graphene microflakes into polymers as a reinforcing material can greatly improve the electrical and thermal conductivity of polymer-based composites, and has broad application prospects in the fields of conductive materials, thermal conductive materials, shielding materials, and electronic packaging. [0003] However, due to the large specific surface area and surface free ...

Claims

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Application Information

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IPC IPC(8): C08K7/00C08K5/5425C08K5/5435C08K5/10C08L23/12C08L55/02
CPCC08K5/10C08K5/5425C08K5/5435C08K7/00C08K2201/001C08K2201/003C08L23/12C08L55/02
Inventor 张婧婧何穗华
Owner GUANGDONG UNIV OF TECH
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