Method for manufacturing pinboard
An adapter board and substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems affecting device electrical characteristics, device reliability, and reliability, etc., to prevent metal diffusion , to ensure consistency, the effect of a good adhesive layer
Inactive Publication Date: 2017-11-17
NAT CENT FOR ADVANCED PACKAGING
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Problems solved by technology
During the TSV etching process, due to the uneven distribution of the etching plasma, there will be a certain depth difference in the etched TSV depth, thus introducing a larger total thickness difference TTV (total thickness variation), which will cause great difficulties to the subsequent process, so as to affect the reliability of the device
In addition, wet etching is often used to remove the insulating layer at the exposed head of the TSV structure during the outcropping process, but the removal of the insulating layer will also cause etching of the barrier layer at the exposed head of the TSV structure. etch, while missing barrier layers affect the electrical characteristics of the device, thereby affecting reliability
Method used
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[0036] It should be noted that components in the various figures may be shown exaggerated for the purpose of illustration and are not necessarily true to scale. In the various figures, identical or functionally identical components are assigned the same reference symbols.
[0037] Unless otherwise specified, in this application, the quantifiers "a" and "an" do not exclude the scene of multiple elements.
[0038] Also, when a layer is described as being on another layer or substrate, the layer can be directly on the other layer or substrate, or intervening layers may also be present therebetween.
[0039] Figures 1 to 14 A schematic diagram of the interposer 100 after processing according to each step of the method of the present invention is shown.
[0040] figure 1 is a cross-sectional view of the adapter board 100 after step 1 is performed. In step 1, a first carrier 101a is provided, and a substrate 103 is disposed thereon. like figure 1 As shown, the substrate 103 ...
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Abstract
The invention relates to a method for manufacturing a pinboard. By the method, the consistency of through silicon via (TSV) etching depth is ensured as well as the step of a TSV back-surface exposed head corrosion process is omitted; and moreover, a gap structure which is not covered by a blocking layer can be prevented from being formed during the etching process of an insulation layer, so that electrical characteristic and the reliability of the device are improved. The invention also relates to the pinboard manufactured by the method.
Description
technical field [0001] The present invention generally relates to the field of semiconductor manufacturing, and in particular to a method for manufacturing an interposer. Background technique [0002] With the development of computers, communications, automotive electronics, aerospace industry and other consumer systems, the requirements for the size and power consumption of semiconductor chips continue to increase, that is, they need to be smaller, thinner, lighter, highly reliable, and multi-functional. , low power consumption and low-cost chips, in this context three-dimensional packaging technology came into being. When the packaging density of two-dimensional packaging technology has reached its limit, the advantages of higher density three-dimensional packaging technology are self-evident. [0003] An important type of three-dimensional packaging technology is stacked three-dimensional packaging, in which a plurality of chips or multi-chip modules (MCMs) are arranged ...
Claims
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IPC IPC(8): H01L21/768H01L23/498H01L23/528
CPCH01L21/7685H01L23/49811H01L23/528H01L2224/11H01L2224/14181
Inventor 王磊
Owner NAT CENT FOR ADVANCED PACKAGING