A manufacturing process of an ultra-miniature semiconductor refrigeration device

Abstract

The invention discloses a manufacturing process of an ultra-miniature semiconductor refrigeration device, comprising the following steps: step S1, bonding a wafer sprayed with a metal coating on a blue film, cutting the wafer into crystal grains, and using an expanding film The machine expands the blue film and the crystal grains bonded thereon, and places the expanded blue film on the side of the crystal grain; step S2, using the suction head on the chip arrangement machine to absorb the crystal grains on the mold obtained in step S1 and place it on the designated position of the tile; step S3, place the tile obtained in step S2 on the heating table of the rework station, align the other tile with the tile obtained in step S2 and stick it tightly, and then start The heating table is heated and welded, and cooled after the welding is completed. Among them, since the placement of the die is automatically sucked and released by the chip arrangement machine, the position of the die is more accurate, and the upper and lower tiles are aligned using the optical alignment system of the rework table to achieve the purpose of aligning the upper and lower tiles, which is more efficient and easy to operate. more precise.

Description

technical field [0001] The invention relates to the field of semiconductor refrigeration devices, in particular to a manufacturing process of ultra-miniature semiconductor refrigeration devices. Background technique [0002] The working principle of the semiconductor refrigeration device is based on the Peltier principle, that is, when a circuit composed of an N-shaped semiconductor and a P-shaped semiconductor is connected to a direct current, some other heat will be released at the joint in addition to Joule heat. The other joint absorbs heat. Existing semiconductor refrigeration devices generally include porcelain plates and semiconductor crystal grains. The semiconductor grains are welded on the porcelain plate. The porcelain plate plays the role of electrical insulation, heat conduction and support. The main functional part of the cold component, the crystal grain is soldered to the metallization layer of the porcelain plate by soldering. [0003] For conventional sem...

AI Technical Summary

Problems solved by technology

Therefore, due to the above-mentioned characteristics of the ultra-miniature semiconductor refrigeration device itself, the manufacturing process of the existing conventional semiconductor refrigeration device cannot meet the requirements for the production of the ultra-miniature semiconductor refrigeration device.

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