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Atomization device for preparing alloy metal powder

A metal powder and atomization device technology, which is applied in metal processing equipment, transportation and packaging, chemical instruments and methods, etc., can solve the problems of blockage of the powder feeding system for conveying alloy powder, great difference in melting point, uneven powder feeding, etc. To achieve the effect of reducing the bonding phenomenon between powders, realizing modification and passivation, and achieving significant effects

Pending Publication Date: 2017-11-24
DONGJUN NEW ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the alloy powders used in the field of solar energy are mainly prepared by gas atomization powder making equipment, which is mainly used to prepare various metal powders, because the melting points of the metal components in the alloy powders used in the solar energy field are very different. Large, for example, in the copper indium gallium alloy, the melting point of indium is 156.6°C, the melting point of gallium is 29.8°C, and the melting point of copper is 1083.4°C. In the alloy phase of copper indium gallium alloy powder, there are mainly indium-based alloy phase and copper gallium metal However, due to the low melting point of indium-based alloys and the large solid-liquid coexistence temperature range of copper-indium-gallium alloys, the solid-liquid coexistence temperature range reaches 250-600°C, which leads to the current gas atomization powder making device manufacturing The obtained alloy powder has severe agglomeration and adhesion sites, and a large number of small satellite spheroids adhere to the surface of the alloy powder particles, which not only makes the yield of the alloy powder too low, but also leads to poor fluidity of the alloy powder, which affects the subsequent use of the alloy powder. For example, when spraying target materials, the blockage of the powder feeding system and uneven powder feeding often occur when conveying alloy powder, which also affects the performance of the final product.

Method used

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  • Atomization device for preparing alloy metal powder
  • Atomization device for preparing alloy metal powder
  • Atomization device for preparing alloy metal powder

Examples

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Effect test

Embodiment 1

[0034] Such as figure 1 As shown, an atomization device for preparing alloy metal powder includes a main body 1. The main body 1 has a cylindrical tower body and a conical bottom. The main body 1 is sequentially provided with a vacuum melting chamber 2 and an atomizing chamber from top to bottom. 3. The vacuum melting chamber 2 is set directly above the atomization chamber 3, and is separated by a plate between the vacuum melting chamber 2 and the atomization chamber 3. The vacuum melting chamber 2 is provided with a melting device 5 and a heating device 4, In this embodiment, the melting device 5 is a crucible, and the heating device 4 is arranged around the melting device 5. The heating device 4 can heat the melting device 5, and can heat the temperature in the melting device 5 to make the alloy in the melting device 5 The metal is all melted into alloy metal liquid, and a liquid outlet 18 is provided at the bottom of the melting device 5, and the liquid outlet 18 communicat...

Embodiment 2

[0044] The difference between embodiment 2 and embodiment 1 is that, as figure 2 , image 3 with Figure 4 As shown, the air intake device 12 includes a connecting pipe 19 and an annular metal pipe 20, the connecting pipe 19 is vertically fixed on the top of the atomization chamber 3, the top of the connecting pipe 19 communicates with the buffer cavity 15 in the buffer disk 13, and the bottom of the connecting pipe 19 communicates with the buffer cavity 15 in the buffer disk 13. The end communicates with the annular metal pipe 20, and the bottom of the annular metal pipe 20 is provided with air injection holes, and the air injection holes are evenly spaced along the circumferential direction of the annular metal pipe 20; in the present embodiment, the air injection holes on the annular metal pipe 20 can be more effective. It is conducive to the uniform delivery and distribution of oxygen-containing gas in the atomization area.

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Abstract

The invention discloses an atomization device for preparing alloy metal powder. The atomization device comprises a body. A vacuum melting chamber and an atomization chamber are sequentially arranged in the body from top to bottom. A melting device and a heating device are arranged in the vacuum melting chamber. The heating device heats the melting device. The melting device comprises a liquid outlet. The liquid outlet communicates with the top of the atomization chamber through a diversion pipe. A gas spray nozzle is arranged in the atomization chamber and is connected with high-pressure inert gas through a pipeline. The gas spray nozzle sprays the high-pressure inert gas towards an outlet of the diversion pipe. An oxygen-containing gas pipeline and a gas inlet device connected with the oxygen-containing gas pipeline are arranged in the atomization chamber. The oxygen-containing gas pipeline conveys oxygen-containing gas into the atomization chamber through the gas inlet device. By means of the atomization device, the surface of the alloy metal powder can be passivated in the atomization process, and therefore the sphericity degree of copper, indium and gallium alloy powder and the phenomenon of the strong adhesion among the powder are controlled.

Description

technical field [0001] The invention relates to an atomizing device, in particular to an atomizing device for preparing alloy metal powder. Background technique [0002] At present, the alloy powders used in the field of solar energy are mainly prepared by gas atomization powder making equipment, which is mainly used to prepare various metal powders, because the melting points of the metal components in the alloy powders used in the solar energy field are very different. Large, for example, in the copper indium gallium alloy, the melting point of indium is 156.6°C, the melting point of gallium is 29.8°C, and the melting point of copper is 1083.4°C. In the alloy phase of copper indium gallium alloy powder, there are mainly indium-based alloy phase and copper gallium metal However, due to the low melting point of indium-based alloys and the large solid-liquid coexistence temperature range of copper-indium-gallium alloys, the solid-liquid coexistence temperature range reaches 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08
CPCB22F9/082B22F2009/0848B22F2009/0876B22F2009/088B22F2998/10B22F1/145B22F2999/00B22F2201/03B01D46/0027B22F2201/10
Inventor 曾玉林万捷吴福忠黄喜南徐晓华蔡爱玲
Owner DONGJUN NEW ENERGY CO LTD
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