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Anisotropic conductive film, connection method, and bonded body

An anisotropic, conductive connection technology, applied in conductive adhesives, electric solid devices, semiconductor devices, etc., can solve the problem of corroding the metal parts of electronic components and wiring

Active Publication Date: 2020-09-29
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although the cation-curable anisotropic conductive film has excellent adhesion to glass, the acid generated when the cationic curing agent is used will remain in the film after participating in the polymerization of the curable resin, so corrosion of electronic components occurs. Such problems as wiring and other metal parts

Method used

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  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body

Examples

Experimental program
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Effect test

Embodiment 1

[0105]

[0106] 34.5 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Steel Sumitomo Chemical Co., Ltd.), 35 parts by mass of epoxy resin (EP828, manufactured by Mitsubishi Chemical Corporation), cationic curing agent (San-Aid SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd., 10 parts by mass of sulfonium salt-type cationic curing agent (reaction initiation temperature 90° C.), 5 parts by mass of silane coupling agent (KBE403, manufactured by Shin-Etsu Silicone Co., Ltd.), 10 parts by mass of conductive particles (AUL704, produced by Sekisui Chemical Industry Co., Ltd., metal-coated resin particles with Ni / Au plating film formed on the surface of acrylic resin particles, average particle diameter 4.0 μm), organic peroxide (PERBUTYL L, 5 parts by mass of NOF Corporation (reaction initiation temperature: 108° C.)) and 0.5 part by mass of a radical scavenger (tert-butylhydroquinone (TBHQ) manufactured by Tokyo Chemical Industry Co., Ltd.) were...

Embodiment 2～7

[0145] In Example 1, except that the composition of the anisotropic conductive film was changed as shown in Table 1-1 and Table 1-2, the anisotropic films of Examples 2 to 7 were produced in the same manner as in Example 1. Conductive films and bonded bodies.

[0146] In addition, in Example 2 and Examples 4-7, except having set the temperature of the heater to 125 degreeC as an annealing process, it carried out similarly to Example 1, and obtained the annealed material. In addition, in Example 3, except having set the preset temperature of a heater to 150 degreeC, it carried out similarly to Example 1, and obtained the annealed material.

[0147] The same evaluation as in Example 1 was performed on the obtained bonded body. The results are shown in Table 2-1 and Table 2-2.

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Abstract

The present invention provides an anisotropic conductive film, which is characterized in that it is an anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, and the above-mentioned anisotropic conductive film is at least Contains conductive particles, a cation curable resin, a cationic curing agent, an organic peroxide, and a radical scavenger whose reaction initiation temperature is higher than the reaction initiation temperature of the cationic curing agent.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] Conventionally, an anisotropic conductive film (ACF; Anisotropic Conductive Film) has been used as a method of connecting electronic components. [0003] The said anisotropic conductive film is a conductive film produced by apply|coating and drying the resin mixture containing electroconductive particle on a film. As a connection method between electronic components, it is a method in which the above-mentioned anisotropic conductive film is placed on one side of the circuit to be connected (or sometimes both sides of the circuit to be connected), and a predetermined temperature and pressure are applied to conduct the circuit. electrical connection between. [0004] In order to mount IC chips and flexible substrates on glass substrates such as liquid crystal displays, cation-curable anisotropic conductive films (ACF) ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J7/10C09J9/02C09J11/02C09J201/00H05K3/32H05K3/36
CPCC09J9/02C09J11/02C09J201/00H05K3/32H05K3/36H01L2224/29C09J2203/326C09J7/10C09J7/00C09J2301/314
Inventor 伊藤将大工藤克哉
Owner DEXERIALS CORP