Slag removing mechanism for PCB hole

Abstract

The invention discloses a slag removing mechanism for a PCB hole. The slag removing mechanism for the PCB hole comprises a motor, a supporting plate, an air box, a clamping head, a hollow sleeve pipe, two limiting sleeves and two drilling tool mechanisms, wherein the limiting sleeves and the drilling tool mechanisms are symmetrically arranged along the hollow sleeve pipe, the hollow sleeve pipe is inserted into a hole needing to be subjected to slag removing, and then, the motor works so as to drive the hollow sleeve pipe to rotate, the drilling tool mechanisms slowly extend out due to the effect of bearing centrifugal force under the damping effect of an elastic column, tool bits arranged on the drilling tool mechanisms smash and remove the adhered slag in the hole, a brush cleans the hole wall which is subjected to machining by the tool bits, and thus slag is removed; and meanwhile, negative pressure is pumped out of the air box through an air pipe, the dissociative waste slag enters the air box successively passing through the hollow sleeve pipe, slag discharging holes arranged on the clamping head, and further is discharged out through the air pipe. The slag removing mechanism is simple in structure, can effectively remove the slag and the dust adhered to the inner wall of the PCB hole, not only is environmentally friendly, but also has a good removal effect, and meanwhile, the slag can be automatically absorbed and discharged, secondary adhesion of the slag can be prevented, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a mechanical device, in particular to a PCB hole slag removal mechanism. Background technique [0002] Printed circuit board, also known as PCB board, is the support body of electronic components and the carrier of electrical connection of electronic components. The manufacturing process of PCB board is complicated. The general process is: cutting, drilling, electroless copper (PTH) Copper plating and electroplating, pattern transfer (circuit), pattern electroplating (second copper) and protective tin plating, etching (SES), intermediate inspection, solder mask (SolderMask), printing characters, metal surface treatment, finished product molding, electrical testing, appearance Inspection (FQC / OQA), packaging and shipment, after the PCB board is drilled, there is a certain probability that glue residue will adhere to the PCB hole. Therefore, the PCB board needs to be desmeared before copper sinking. The PCB board is soaked in th...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a PCB board hole slag removal mechanism to solve the problem of poor environmental protection by using chemicals to remove glue residue in PCB board holes

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