Normal-temperature fast-curing phosphosilicate inorganic adhesive and preparation method of adhesive

An inorganic adhesive, fast curing technology, applied in the field of adhesives, can solve the problems of non-compliance with environmental protection requirements, complex sizing process, etc., and achieve the effect of high toughness, simple construction process and fast bonding

Inactive Publication Date: 2017-12-22
WUXI HAITE NEW MATERIAL RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Adhesives for ceramic materials with strong adhesion are mostly two-component, the sizing process is complicated, and most of them contain organic compounds or polymer materials, which release odors or even toxic gases to varying degrees, which do not meet environmental protection requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Normal temperature quick-curing phospho-silicate inorganic adhesive, which is made of raw materials with the following weight (unit: g):

[0025] Aluminum dihydrogen phosphate 100

[0026] Sodium silicate with modulus 3.0 100

[0027] 300# Portland cement 95

[0028] 0.3mm glass fiber (average diameter 6μm) 35

[0029] Deionized water 185

[0030] DOWEX MAC-3 1g

[0031] Manufacturing method: Dissolve 100g of sodium silicate with a modulus of 3.0 in 185g of deionized water, add 1g of DOWEX MAC-3 and stir, mix the obtained material with 100g of aluminum dihydrogen phosphate, 35g of glass fiber and 95g of 300# Portland The cement is uniformly mixed to obtain the normal-temperature fast-curing phospho-silicate inorganic adhesive.

[0032] Performance indicators: This product is used for bonding ceramic materials. It only needs to be coated with a thin layer to achieve fast bonding and positioning in 5 minutes. After curing at room temperature for 2 hours, the adhesive...

Embodiment 2

[0034] Normal temperature quick-curing phospho-silicate inorganic adhesive, which is made of raw materials with the following weight (unit: g):

[0035] Aluminum dihydrogen phosphate 100

[0036] Sodium silicate with modulus 3.0 98

[0037] 300# Portland cement 92

[0038] 0.3mm glass fiber (average diameter 6μm) 40

[0039] Deionized water 190

[0040] DOWEX MAC-3 0.29g

[0041] Manufacturing method: Dissolve 98g of sodium silicate with a modulus of 3.0 in 190g of deionized water, add 0.29g of DOWEXMAC-3 and stir, mix the obtained material with 100g of aluminum dihydrogen phosphate, 40g of glass fiber and 92g of 300# Portland cement Uniformly mixing can obtain the described room-temperature fast-curing phospho-silicate inorganic adhesive.

[0042] Performance indicators: This product is used for bonding ceramic materials. It only needs to be coated with a thin layer to achieve fast bonding and positioning in 5 minutes. After curing at room temperature for 2 hours, the ad...

Embodiment 3

[0044] Normal temperature quick-curing phospho-silicate inorganic adhesive, which is made of raw materials with the following weight (unit: g):

[0045] Aluminum dihydrogen phosphate 100

[0046] Sodium silicate with modulus 3.0 85

[0047] 300# Portland cement 90

[0048] 0.3mm glass fiber (average diameter 6μm) 30

[0049] Deionized water 150

[0050] DOWEX MAC-3 0.68g

[0051] Manufacturing method: Dissolve 85g of sodium silicate with a modulus of 3.0 in 150g of deionized water, add 0.68g of DOWEXMAC-3 and stir, mix the obtained material with 100g of aluminum dihydrogen phosphate, 30g of glass fiber and 90g of 300# Portland The cement is uniformly mixed to obtain the normal-temperature fast-curing phospho-silicate inorganic adhesive.

[0052] Performance indicators: This product is used for bonding ceramic materials. It only needs to be coated with a thin layer to achieve fast bonding and positioning in 5 minutes. The shear strength reaches 3.0MPa, and the shear stren...

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Abstract

The invention discloses a normal-temperature fast-curing phosphosilicate inorganic adhesive and a preparation method of the adhesive. The normal-temperature fast-curing phosphosilicate inorganic adhesive is characterized by being prepared from the following raw materials in parts by weight: 100 parts of a base material, 85-100 parts of sodium silicate with a modulus of 3.0, 90-100 parts of Portland cement, 30-45 parts of a toughening reinforcing material and 150-200 parts of deionized water. The normal-temperature fast-curing phosphosilicate inorganic adhesive is single-component, and has good adhesive strength, no toxic additive and no VOC emission.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a normal-temperature fast-curing phospho-silicate inorganic adhesive and a preparation method thereof. Background technique [0002] At present, three kinds of adhesives are usually used for bonding ceramic materials: ordinary type, which is suitable for bonding various ceramic materials on ordinary horizontal surfaces; enhanced type, which has strong cohesive force and anti-drop ability, and can be used for ceramics that require high cohesive force. Pasting of material facades; heavy brick type, strong adhesion, rich flexibility, can resist the stress caused by thermal expansion and contraction of the bonding layer, and can be used for various bonding surfaces of ceramic materials and bonding of larger sizes. [0003] Adhesives for ceramic materials with strong adhesion are mostly two-component, the sizing process is complicated, and most of them contain organic compounds or polymer mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/04
CPCC04B28/04C04B2201/50C04B12/04C04B22/16C04B14/42C04B24/24
Inventor 李卫东吴立波黄馨曹英杰卫晓波李小静白永平李晶波殷晓芬
Owner WUXI HAITE NEW MATERIAL RES INST
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