Normal-temperature fast-curing phosphosilicate inorganic adhesive and preparation method of adhesive

Abstract

The invention discloses a normal-temperature fast-curing phosphosilicate inorganic adhesive and a preparation method of the adhesive. The normal-temperature fast-curing phosphosilicate inorganic adhesive is characterized by being prepared from the following raw materials in parts by weight: 100 parts of a base material, 85-100 parts of sodium silicate with a modulus of 3.0, 90-100 parts of Portland cement, 30-45 parts of a toughening reinforcing material and 150-200 parts of deionized water. The normal-temperature fast-curing phosphosilicate inorganic adhesive is single-component, and has good adhesive strength, no toxic additive and no VOC emission.

Description

technical field

[0001] The invention relates to the field of adhesives, in particular to a normal-temperature fast-curing phospho-silicate inorganic adhesive and a preparation method thereof. Background technique

[0002] At present, three kinds of adhesives are usually used for bonding ceramic materials: ordinary type, which is suitable for bonding various ceramic materials on ordinary horizontal surfaces; enhanced type, which has strong cohesive force and anti-drop ability, and can be used for ceramics that require high cohesive force. Pasting of material facades; heavy brick type, strong adhesion, rich flexibility, can resist the stress caused by thermal expansion and contraction of the bonding layer, and can be used for various bonding surfaces of ceramic materials and bonding of larger sizes.

[0003] Adhesives for ceramic materials with strong adhesion are mostly two-component, the sizing process is complicated, and most of them contain organic compounds or polymer mat...