Novel maskless photoetching system and technological process thereof

Abstract

The invention discloses a novel maskless photoetching system and a technological process thereof. The novel maskless photoetching system comprises a material number system, an exposure system, an RIP(Raster Image Processing) module, a data processing module, a position correcting module, a light source module, an illumination system optical module, a graph generator, a master control module, an energy correcting module, a projection lens module, an automatic focusing module, a motion platform module and an alignment module. Compared with a traditional maskless photoetching system, the material number system, the RIP module, the position correcting module, the energy correcting module, the automatic focusing module and the alignment module are added, so that the accuracy and the stabilityof the novel maskless photoetching system are increased, the efficiency and the yield of product processing are increased, the production cost of a product is reduced, high-automation large-scale production application can be realized, the novel maskless photoetching system is particularly suitable for being embedded to a production line in an industry 4.0 grade, and intelligent, unmanned, continuous and stable production operation can be realized.

Description

Technical field: [0001] The invention belongs to the technical field of maskless lithography exposure systems, and in particular relates to a novel maskless lithography system and its technological process. Background technique: [0002] Photolithography is a part of the current mainstream planar processing technology for semiconductors, which is used to form feature patterns of specific structures on the surface of a substrate. Maskless lithography is a branch of lithography. Compared with traditional mask lithography, there is no need to prepare a photomask as a master for reproduction exposure, and a pattern generator is used to replace the master. Directly utilize the pattern generator to generate consistent feature patterns from the design document, and project and expose them to the surface of the substrate coated with the photosensitive material through optical projection technology. [0003] At present, the pattern generators commonly used in maskless lithography te...

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Problems solved by technology

[0004] 1. Laser beam direct writing or acousto-optic modulation method. This method is point-by-point exposure. High-energy laser is used to directly generate graphics on the light-sensitive substrate. The disadvantage is that the processing speed is slow and the exposure time of a single substrate is long, so it cannot be applied Large-scale production can only be used to make master plates such as photomasks, but the relative operating costs are relatively high;

[0005] 2. The spatial light modulator of the reflective device. The disadvantage of this scheme is: on the one hand, the accuracy is not high, because the position signal of the grating ruler of the platform cannot reflect the movement of the exposure surface of the substrate in real time due to external environmental factors and the limitation of the fixed position. location information

On the other hand, the energy stability is poor, because all light so

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