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Packaging method of biological recognition chip and biological recognition module

A biometric identification and packaging method technology, which is applied in the field of semiconductor device preparation, can solve the problems of reducing the reliability of biometric identification modules, low biometric penetration capabilities, and long signal transmission distances, so as to improve the packaging process and improve reliability. and stability, the effect of reducing power consumption

Pending Publication Date: 2018-01-09
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (1), because the signal transmission distance of the packaged biometric identification module in Scheme 1 is too far, resulting in large loss of power consumption and low biometric penetration capability; and the exposed control chip and capacitor resistance reduce the biometric identification module. overall reliability

Method used

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  • Packaging method of biological recognition chip and biological recognition module
  • Packaging method of biological recognition chip and biological recognition module
  • Packaging method of biological recognition chip and biological recognition module

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Experimental program
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Embodiment 1

[0029] Figure 4 It is a schematic flow chart of a biometric chip packaging method provided in Embodiment 1 of the present invention. This embodiment is applicable to the case of a biometric chip packaging structure. Figure 5 It is a schematic structural diagram of a biometric chip provided by an embodiment of the present invention; Figure 6 It is a schematic diagram of a biometric chip packaging structure prepared in the embodiment of the present invention; Figure 7 It is a side view of a biometric identification module prepared in the embodiment of the present invention; Figure 8 It is a top view of a biometric identification module prepared in the embodiment of the present invention. A packaging method for a biometric identification chip provided in an embodiment of the present invention includes:

[0030] Step 110, performing preprocessing on the wafer of the biometric identification chip, the sensing surface of the wafer includes a sensing area and a non-sensing ar...

Embodiment 2

[0053] Figure 7 It is a side view of a biometric identification module provided in Embodiment 2 of the present invention; Figure 8 It is a top view of a biometric identification module provided in Embodiment 2 of the present invention.

[0054] The embodiment of the present invention also provides a biometric identification module, which can be obtained by using the biometric identification chip packaging method provided in the first embodiment of the present invention, such as Figure 7-8 As shown, the biometric module includes:

[0055] Biometric identification chip 1, packaging material, control chip 7, capacitor 8, and resistor 9; wherein, biometric identification chip 1, the sensing surface of the biometric identification chip 1 includes a sensing area 2 and a non-sensing area, and the non-sensing area is set There is at least one of the control chip 7, the capacitor 8 or the resistor 9; the packaging material is used to package the biometric chip 1, and at least one ...

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Abstract

Embodiments of the invention disclose a packaging method of a biological recognition chip and a biological recognition module. The packaging method of the biological recognition chip comprises the steps of performing pretreatment of a wafer of the biological recognition chip, wherein the induction surface of the wafer comprises an induction region and a non-induction region; performing through-silicon-via packaging on the wafer of the biological recognition chip, and setting at least one of a control chip, a capacitor or a resistor in the non-induction region; and cutting the wafer to obtain single biological recognition chips, and performing plastic packaging and module assembling on the single biological recognition chips. The invention provides the packaging method of the biological recognition chip and the biological recognition module, and an improved preparation process; and the signal transmission distance is shortened, the power consumption is lowered, and fingerprint penetrability and sensitivity are improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductor device preparation, and in particular to a method for packaging a biometric identification chip and a biometric identification module. Background technique [0002] The biometric chip is packaged to obtain a biometric module, and the biometric signal is collected through the biometric module and input to the biometric system for identification and processing. Therefore, the quality of biological signals will directly affect the accuracy of recognition and the processing speed of the biometric system, so it is particularly important for the preparation of biometric modules and the packaging of biometric chips. [0003] There are three main technical solutions for the existing biometric chip packaging: [0004] Option one, such as figure 1 as shown, figure 1 It is a structural schematic diagram of the first biometric identification module provided by the prior art,...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L23/31G06K9/00
CPCH01L2924/10155H01L2924/181H01L2224/16225H01L2224/48227H01L2924/00012
Inventor 吕军金科赖芳奇李永智沙长青
Owner 苏州科阳半导体有限公司