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A packaging method for LED surface light source with high display index

A technology of LED surface light source and packaging method, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of low phosphor display index, reduced service life, poor luminous effect, etc., to improve quality, prolong service life, The effect of not easy to bubble

Active Publication Date: 2020-06-30
青岛云源光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The CRI of the existing fluorescent powder is generally not high, and the luminous effect used in the existing surface light source packaging method is poor, the heat is high, and it is not easy to dissipate heat, thereby reducing the service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: In this embodiment, the luminous color of an LED surface light source is warm-colored light as an example, and the color temperature margin phosphor powder in this embodiment is red phosphor powder. The implementation process of this embodiment is as follows: first prepare the LED chip, heat-conducting adhesive, gold wire, silica gel, mirror aluminum and coagulant; then prepare the composite phosphor, and the composite phosphor is modulated according to the following ratio: yellow phosphor: green Phosphor: purple phosphor: red phosphor: cyan phosphor: blue phosphor: color temperature balance phosphor (red phosphor) = 90%: 5%: 2.5%: 1.875%: 0.3125%: 0.15625%: 0.15625 %; then stir and mix the modulated composite fluorescent powder with silica gel and coagulant, fully mix and then precipitate naturally for later use; stick the LED chip on the mirror aluminum through thermal conductive glue, and surround it with a wall to fix it; between the LED chip and Solde...

Embodiment 2

[0018] Embodiment 2: In this embodiment, the light emitting color of LED surface light source is warm white light as an example, and the color temperature margin phosphor powder in this embodiment is red phosphor powder. The implementation process of this embodiment is as follows: first prepare the LED chip, heat-conducting adhesive, gold wire, silica gel, mirror aluminum and coagulant; then prepare the composite phosphor, and the composite phosphor is modulated according to the following ratio: yellow phosphor: green Phosphor powder: purple phosphor powder: red phosphor powder: cyan phosphor powder: blue phosphor powder: color temperature margin phosphor powder (mixed according to the ratio of red phosphor powder: blue phosphor powder = 1:0.075) = 90% : 5% : 2.5% : 1.875% : 0.3125% : 0.15625% : 0.15625%; then stir and mix the prepared composite phosphor with silica gel and coagulant, fully mix and then precipitate naturally for later use; stick the LED chip with heat-conductin...

Embodiment 3

[0019] Embodiment 3: In this embodiment, the light emitting color of an LED surface light source is white light as an example, and the color temperature margin phosphor powder in this embodiment is blue phosphor powder. The implementation process of this embodiment is as follows: first prepare the LED chip, heat-conducting adhesive, gold wire, silica gel, mirror aluminum and coagulant; then prepare the composite phosphor, and the composite phosphor is modulated according to the following ratio: yellow phosphor: green Phosphor: purple phosphor: red phosphor: cyan phosphor: blue phosphor: color temperature balance phosphor (blue phosphor) = 90%: 5%: 2.5%: 1.875%: 0.3125%: 0.15625%: 0.15625%; then stir and mix the prepared composite fluorescent powder with silica gel and coagulant, and form a mixture after mixing the compound phosphor and silica gel. Add 2 grams of coagulant to every 100 grams of the mixture, fully mix and then precipitate naturally for later use ; Adhesive the L...

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PUM

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Abstract

The invention discloses a packaging method, and specifically relates to an LED area light source high CRI (Color Rendering Index) luminescence packaging method comprising the following steps: preparing a composite phosphor modulated according to the following proportions: yellow phosphor: green phosphor: purple phosphor: red phosphor: redder phosphor: cyan phosphor: blue phosphor: color temperature balance phosphor=90%: 5%: 2.5%:1.25%: 0.625%: 0.3125%: 0.15625%: 0.15625%; mixing and stirring the composite phosphor with a silica gel; using a heat-conducting glue to bond an LED chip on a mirrorsurface aluminium, and fencing for fixation; welding a conductive spun gold between the chips; pouring standby composite phosphor on the chip in the LED fence; baking the mirror surface aluminium for2 hours until the LED area light source is fully fixed on the mirror surface aluminium. The packaging method can satisfy the high CRI (Color Rendering Index) luminescence requirements, can reduce theformed heat energy, thus prolonging the product service life.

Description

technical field [0001] The invention relates to a packaging method, in particular to a packaging method for LED surface light sources to emit light with high CRI. Background technique [0002] LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally, the die of a discrete device is sealed in a package, and the function of the package is mainly to protect the die and complete electrical interconnection. The LED packaging is to complete the output of electrical signals, protect the normal operation of the die, and output visible light. It has both electrical parameters and optical parameters design and technical requirements. It is impossible to simply use the packaging of discrete devices for LEDs. [0003] LED surface light source packaging is also called COB (Chip On Board) packaging. COB packaging can directly package multiple chips on a metal-based printed circuit board (MCPCB...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/56
Inventor 孔天波郑伟成
Owner 青岛云源光电科技有限公司