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Reaction chamber and processing method used for PVD film coating

A reaction chamber and processing method technology, applied in the field of PVD coating reaction chamber, can solve the problems of poor selectivity of film-forming materials, difficulty in maintaining discharge phenomenon, and long electron mean free path, so as to improve performance and avoid product coating failure. Uniform, efficiency-enhancing effect

Inactive Publication Date: 2018-01-23
苏州安江源光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under normal circumstances, the method of magnetron sputtering for PVD coating mainly has the following defects: First, although magnetron sputtering can obtain a large-area evenly distributed film, the selectivity of the film-forming material is relatively poor, and the film-forming The thickness also has great limitations; second, the working pressure of magnetron sputtering is high, otherwise the mean free path of electrons is too long, and the discharge phenomenon is not easy to maintain, resulting in a greater possibility of film contamination

Method used

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  • Reaction chamber and processing method used for PVD film coating

Examples

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Effect test

specific Embodiment example 1

[0030] A processing method for PVD coating, comprising:

[0031] Vacuum extraction: place the coated workpiece on the top of the chamber, and use a vacuum pump to evacuate the chamber to vacuum.

[0032] Heating the target material: Select the target material according to the requirements of the explosion-proof film product, rotate the required target material to the upper end of the electron gun, start the electron gun, and heat the target material to evaporate it.

[0033] Coating: The target material is heated and evaporated to the top of the chamber by the electron gun, and deposited on the product workpiece on the top of the chamber.

[0034] A reaction chamber for PVD coating, comprising: a reaction chamber body 1, an electron gun crucible platform 2, a vacuum pump 3, and a product station 4 to be coated, wherein the product station 4 to be coated is installed on the side of the reaction chamber body 1 At the top, an electron gun crucible platform 2 is installed at the ...

specific Embodiment example 2

[0037] A processing method for PVD coating, comprising:

[0038] Vacuum extraction: place the coated workpiece on the top of the chamber, and use a vacuum pump to evacuate the chamber to vacuum.

[0039] Heating the target material: Select the target material according to the requirements of the explosion-proof film product, rotate the required target material to the upper end of the electron gun, start the electron gun, and heat the target material to evaporate it.

[0040] Coating: The target material is heated and evaporated to the top of the chamber by the electron gun, and deposited on the product workpiece on the top of the chamber.

[0041]A reaction chamber for PVD coating, comprising: a reaction chamber body 1, an electron gun crucible table 2, a vacuum pump 3, and a product station 4 to be coated, wherein the product station 4 to be coated is installed on the side of the reaction chamber body 1 At the top, an electron gun crucible platform 2 is installed at the bott...

specific Embodiment example 3

[0044] A processing method for PVD coating, comprising:

[0045] Vacuum extraction: place the coated workpiece on the top of the chamber, and use a vacuum pump to evacuate the chamber to vacuum.

[0046] Heating the target material: Select the target material according to the requirements of the explosion-proof film product, rotate the required target material to the upper end of the electron gun, start the electron gun, and heat the target material to evaporate it.

[0047] Coating: The target material is heated and evaporated to the top of the chamber by the electron gun, and deposited on the product workpiece on the top of the chamber.

[0048] A reaction chamber for PVD coating, comprising: a reaction chamber body 1, an electron gun crucible table 2, a vacuum pump 3, and a product station 4 to be coated, wherein the product station 4 to be coated is installed on the side of the reaction chamber body 1 At the top, an electron gun crucible platform 2 is installed at the bot...

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Abstract

A reaction chamber and processing method for PVD film coating, comprising: vacuum extraction, target heating, and film coating. The PVD coating reaction process is carried out in a completely sealed vacuum reaction chamber, and the target is heated by an electron gun to evaporate the target to the surface of the workpiece to form a coating. Using the above PVD reaction chamber, including the reaction chamber body, electron gun crucible table, vacuum pump and product station to be coated, wherein the electron gun crucible table has multiple concave grooves, and different target materials are placed in each groove, which can According to the needs of the explosion-proof film, the concave cavity where the required target material is located is heated separately, the structure is simple, the use is convenient, and the practicability is strong.

Description

technical field [0001] The invention belongs to the field of explosion-proof membranes, and in particular relates to a reaction chamber for PVD coating and a processing method. Background technique [0002] PVD is the abbreviation of Physical Vapor Deposition. It refers to the use of low-voltage, high-current arc discharge technology under vacuum conditions, using gas discharge to evaporate the target material and ionize the evaporated material and gas, and to use the acceleration of the electric field. The evaporated substance and its reaction product are deposited on the workpiece for vacuum coating. Use physical processes to realize material transfer, and form metal or compound coatings with special properties on the surface of the workpiece. The special properties include high strength, wear resistance, heat dissipation, corrosion resistance, oxidation resistance, and insulation. The substance source of the coating is a solid substance. The target is evaporated or ioniz...

Claims

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Application Information

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IPC IPC(8): C23C14/30
Inventor 童磊
Owner 苏州安江源光电科技有限公司
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