A method and system for evaluating the impact of dust on a mask plate

Abstract

The invention discloses a dust influence evaluation method and system of a mask, and belongs to the technical field of manufacturing of an integrated circuit and applied to a photoetching process of integrated circuit research stage. The dust influence evaluation method comprises the following steps of S1, detecting influence regions of all dust on the mask respectively on the mask; S2, generatinga detection template for dust detection on a special region on a surface of the mask, wherein the detection template comprises a mask pattern and a target detection region, the mask pattern is corresponding to the mask, and the target detection region is arranged on the mask pattern; S3, embedding a detection result to the detection template, and analyzing a position relation between all influence regions and the respective target detection region; and S4, evaluating the influence of the dust on the surface of the mask on a current photoetching process. The dust influence evaluation method disclosed by the technical scheme of the invention has the beneficial effects that surface dust detection is performed on the special region of the mask, the rework ratio of a wafer during the photoetching process is reduced, so that the research cost is reduced, and the research progress is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method and system for evaluating the influence of dust on a mask plate in a photolithography process in the development stage of an integrated circuit. Background technique [0002] An integrated circuit (integrated circuit) is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with the required circuit function; it is through oxidation, photolithography, diffusion, epitaxy, aluminum evaporation and other semiconductor manufacturing processes, and the semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and their compon...

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Problems solved by technology

In the process of new product process development, engineers usually conduct research on circuits in different regions. Therefore, after a lithography process is completed, it is only necessary to ensure that the lithography at a specific process position is free of defects. However, in the actual development process, engineers Only pay attention to the pattern in some areas of the mask. When the dust on the mask exceeds the threshold, the wafer is directly reworked in the photolithography process. It does not consider whether the specific area will be damaged when the dust exceeds the threshold. Cause defects, so that the probability of wafer rework in the lithography process during the research and development stage is high, which not only increases the cost of the research and development process, but also affects the progress of research and development

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