Production method for composite copper wire with melamine formaldehyde resin

Abstract

The invention discloses a production method for a composite copper wire with melamine formaldehyde resin. The production method of the composite copper wire comprises the steps that electrolytic copper, niobium, vanadium, antimony trioxide and melamine formaldehyde resin are mixed according to a specific ratio, and then undergo vacuum melting and pouring; re-melting and casting are carried out toform a composite copper rod; coarse drawing is carried out to acquire the composite copper wire; the composite copper wire undergoes annealing and water cooling, and is coated with a protective layer;and a finished product is acquired after packaging. The high temperature softening temperature of the composite copper wire prepared by the method is obviously improved. The composite copper wire hasthe advantages of low cost and good application prospect, and can meet the requirement of the industry. The invention further discloses the application of the composite copper wire prepared by the method in an integrated circuit.

Description

Technical field [0001] The invention relates to the technical field of metal material processing, in particular to a production method of composite copper wire added with melamine formaldehyde resin. Background technique [0002] Although the chips obtained after the manufacture of semiconductor integrated circuits have specific functions, they must be connected with external electronic components to realize this function. The semiconductor integrated circuit chip needs to go through a bonding process with the package body to finally obtain a chip package, so that it can be connected to external electronic components through the pins of the package. In the bonding process of the chip and the package, the pads on the chip and the pins of the package are electrically connected through bonding wires. Therefore, the bonding wire is an indispensable material for realizing chip functions. The commonly used bonding alloy wire in the past has a high cost, and as a connection lead, its ...

AI Technical Summary

Problems solved by technology

Its boiling point is 3380°C, pure vanadium is hard, non-magnetic, and ductile, but if it contains a small amount of impurities, especially nitrogen, oxygen, hydrogen, etc., its plasticity can be significantly reduced