Unlock instant, AI-driven research and patent intelligence for your innovation.

Production method of composite copper wire by adding melamine formaldehyde resin

A technology of melamine formaldehyde resin and production method, which is applied in the directions of coating, cable/conductor manufacturing, and wiring harness manufacturing, etc., can solve problems such as reducing plasticity, achieve high temperature softening temperature, strong practicability, and suitable for large-scale industrial application. Effect

Active Publication Date: 2019-09-13
南通江涌投资开发有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its boiling point is 3380°C, pure vanadium is hard, non-magnetic, and ductile, but if it contains a small amount of impurities, especially nitrogen, oxygen, hydrogen, etc., its plasticity can be significantly reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) According to the weight percentage of electrolytic copper 85wt%, niobium 7wt%, vanadium 4wt%, antimony trioxide 2.5wt%, and melamine formaldehyde resin 1.5wt%, the raw materials with good proportioning are put into the vacuum melting furnace , start heating when the vacuum reaches 0.1Pa, when the temperature rises to 1600°C, keep it warm for 50 minutes, then stir for 15 minutes, and start vacuum casting;

[0027] (2) The composite copper ingot obtained by casting is melted under the protection of argon gas, drawn and cast to form a composite copper rod, the flow rate of the gas is 150L / h, and the melting temperature is 1800°C;

[0028] (3) Roughly draw the composite copper rod obtained by smelting to obtain a composite copper wire with a diameter of 2 mm, anneal the composite copper wire at an annealing temperature of 320° C., and an annealing time of 45 minutes, and water-cool after the annealing is completed;

[0029] (4) coating protective layer liquid on the com...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
boiling pointaaaaaaaaaa
densityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a production method for a composite copper wire with melamine formaldehyde resin. The production method of the composite copper wire comprises the steps that electrolytic copper, niobium, vanadium, antimony trioxide and melamine formaldehyde resin are mixed according to a specific ratio, and then undergo vacuum melting and pouring; re-melting and casting are carried out toform a composite copper rod; coarse drawing is carried out to acquire the composite copper wire; the composite copper wire undergoes annealing and water cooling, and is coated with a protective layer;and a finished product is acquired after packaging. The high temperature softening temperature of the composite copper wire prepared by the method is obviously improved. The composite copper wire hasthe advantages of low cost and good application prospect, and can meet the requirement of the industry. The invention further discloses the application of the composite copper wire prepared by the method in an integrated circuit.

Description

technical field [0001] The invention relates to the technical field of metal material processing, in particular to a method for producing composite copper wires added with melamine-formaldehyde resin. Background technique [0002] Although the chip obtained after the semiconductor integrated circuit is manufactured has a specific function, it must be connected with external electronic components to realize this function. The semiconductor integrated circuit chip needs to go through a bonding process with the package body, and finally get the chip package, so that it can be connected to external electronic components through the package pins. In the bonding process of the chip and the package, the bonding pads on the chip are electrically connected to the pins of the package through bonding wires. Therefore, the bonding wire is an essential material to realize the function of the chip. In the past, the cost of the commonly used bonding gold wire is high, and as a connecting...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/012H01B13/22C22C9/00C22C32/00C09D129/04C09D5/08
Inventor 邵光伟
Owner 南通江涌投资开发有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com