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Corona-resistant PI (polyimide) film and preparation method thereof

A corona-resistant and thin-film technology, which is applied in the field of corona-resistant PI thin films and their preparation, can solve problems such as imperfect flatness and intrinsic properties, difficult control of the preparation process, and poor dimensional stability, so as to improve flatness and Intrinsic performance, improvement of corona resistance performance, effect of potential processability

Inactive Publication Date: 2018-02-02
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyimide film prepared by this method has low strength, poor rigidity and poor dimensional stability, and the process is complicated and the preparation process is not easy to control.
Moreover, the polyimide film produced by the common formula is not perfect in flatness and internal performance, and cannot well meet the needs of users.

Method used

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  • Corona-resistant PI (polyimide) film and preparation method thereof
  • Corona-resistant PI (polyimide) film and preparation method thereof
  • Corona-resistant PI (polyimide) film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of anti-corona PI film is made up of following components by weight parts:

[0024]

[0025]

[0026] The preparation method of corona resistant PI thin film, comprises the following steps:

[0027] a. Grinding and fully grinding 4,4-diaminodiphenyl ether, pyromellitic dianhydride and biphenyl bisether dianhydride respectively;

[0028] b. Add the raw materials 4,4-diaminodiphenyl ether, pyromellitic dianhydride, and biphenyl ether dianhydride obtained in step a into the reactor with N,N-dimethylacetamide added respectively , after mixing and reacting, add nano-fillers and lubricants, mix evenly, and perform defoaming treatment on the synthesized polyamic acid solution;

[0029] c. Press the polyamic acid solution defoamed in step b into the casting nozzle storage tank on the front head through the pipeline from the stainless steel solution storage tank, and the steel strip in the casting machine runs at a constant speed, and the polyamic acid solution in ...

Embodiment 2

[0033] A kind of anti-corona PI film is made up of following components by weight parts:

[0034]

[0035] The preparation method is as in Example 1.

Embodiment 3

[0037] A kind of anti-corona PI film is made up of following components by weight parts:

[0038]

[0039]

[0040] The preparation method is as in Example 1.

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Abstract

The invention discloses a corona-resistant PI (polyimide) film, which comprises the following components in parts by weight: 13-20 parts of 4,4'-diaminodiphenyl ether, 9-12 parts of pyromellitic dianhydride, 8-14 parts of biphenylether dianhydride; 2-5 parts of a nano filler; 160-190 parts of N, N-dimethylacetamide and 0.5-2 parts of a lubricant. The polyimide film prepared by the method has the advantages of strength, rigidity and dimensional stability; the film is produced through a casting nozzle and a casting machine has good uniformity, and the surface is clean and flat; by a biaxial stretching and heat treatment process, the longitudinal modulus and the transverse modulus of the polyimide film can be further improved, and thermal expansion coefficient and thermal shrinkage can be reduced.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to a corona-resistant PI film and a preparation method thereof. Background technique [0002] Polyimide film is referred to as PI film for short, including two types of phenylene polyimide film and biphenyl polyimide film. The former is a product of DuPont Company of the United States, and its trade name is Kapton, which is prepared from pyromellitic anhydride and diaminodiphenyl ether. The latter is produced by Japan's Ube Industries, with a trade name of Upilex, which is made from biphenyltetracarboxylic dianhydride and diphenyl ether diamine (R type) or m-phenylenediamine (S type). [0003] Polyimide resin is widely used in the fields of electrical / electronic materials, space / aviation and electrical communication due to its excellent mechanical and thermal dimensional stability and chemical stability. In particular, since polyimide resins have high insulating propertie...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/36C08K3/22C08K5/098C08G73/10C08J5/18
CPCC08K3/36C08G73/1042C08G73/1046C08G73/1071C08J5/18C08J2379/08C08K3/22C08K5/098C08K2003/2227C08K2003/2241C08K2201/011C08L79/08
Inventor 王雪雪
Owner ANHUI GUOFENG PLASTIC
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